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Last edited anonymously
April 1, 2008 | History
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Liu, Yong

We need a photo of Liu, Yong

Date jin shi 1034

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  • Cover of: Computational Intelligence and Intelligent Systems: 7th International Symposium, ISICA 2015, Guangzhou, China, November 21-22, 2015, Revised Selected Papers

    First published in 2016 — 6 editions
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  • Cover of: Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

    First published in 2011 — 4 editions
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  • Cover of: Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

    First published in 2014 — 4 editions
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  • Cover of: Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery

    First published in 2019 — 4 editions
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  • Cover of: Yue zhang ji

    First published in 1922 — 4 editions
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  • Cover of: Artificial Intelligence Algorithms and Applications: 12th International Symposium, ISICA 2021, Guangzhou, China, November 20-21, 2021, Revised Selected Papers

    First published in 2020 — 3 editions
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  • Cover of: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

    First published in 2012 — 3 editions
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  • Cover of: Yue zhang ji

    First published in 2005 — 2 editions
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  • Cover of: Zhongguo xian dai wen xue shi
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    First published in 2006 — 2 editions
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  • Cover of: Passive and Active Measurement: 16th International Conference, PAM 2015, New York, NY, USA, March 19-20, 2015, Proceedings

    First published in 2015 — 2 editions
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  • Cover of: 3D Cinematic Aesthetics and Storytelling

    First published in 2018 — 2 editions
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  • Cover of: Liu Yong ci ji

    First published in 2009 — 2 editions
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  • Cover of: Value in Business: A Holistic, Systems-Based Approach to Creating and Achieving Value

    First published in 2021 — 2 editions
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  • Cover of: Melt Electrospinning: A Green Method to Produce Superfine Fibers

    First published in 2019 — 2 editions
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  • Cover of: Evolvable Hardware (Genetic and Evolutionary Computation)

    First published in 2006 — 2 editions
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  • Cover of: Titanium Powder Metallurgy and Additive Manufacturing

    First published in 2018 — 1 edition
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  • Cover of: Porous Metals and Metallic Foams

    First published in 2018 — 1 edition
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  • Cover of: Zhua zhu shu yu ni de na ke xiao xing xing: Quan cai tu wen zhen cang ban
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    First published in 2014 — 1 edition
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  • Cover of: Oxide Thermoelectric Materials - From Basic Principles to Applications

    First published in 2019 — 1 edition
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  • Cover of: Liu yong chao qiang shuo hua shu: Ba hua shuo dao xin wo li
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    First published in 2012 — 1 edition
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We need a photo of Liu, Yong

Date jin shi 1034

Subjects

History, Ci (Chinese poetry), Electronic packaging, Evolutionary computation, San wen, San wen ji, Artificial intelligence, Chinese essays, Chinese literature, Chinese poetry, Computer networks, Computer science, Congresses, Criticism and interpretation, Design and construction, Digital integrated circuits, Engineering, Evolutionary programming (Computer science), History and criticism, TECHNOLOGY & ENGINEERING, Xuan ji ., Additive manufacturing, Alliages, Antiquities, Appareils thermoélectriques

Places

China, Mei guo, Sichuan Sheng, Cishan, Guangdong Sheng, Guangdong Sheng (China), Hebei Sheng (China), Hongdong Xian, Hongdong Xian (China), Ningxia Huizu Zizhiqu, Ningxia Huizu Zizhiqu (China), Sichuan Sheng (China), Taiwan, Tibet Autonomous Region, Yellow River Region (China), Yonghe Xian (China), Yunnan Sheng, Zhong guo, mei guo

People

Yong Liu (jin shi 1034), Benhuan (1907-), Cai Li (jin shi 1562)

Time

20th century, Song dynasty, 960-1279, Xian dai, Xiandai, 1949-, 19th century, 21st century, 960-1644, Xian dai ., xian dai

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ID Numbers

  • OLID: OL1376402A

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History

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April 1, 2008 Created by an anonymous user initial import