An edition of Microscale heat conduction in integrated circuits and their constituent films (1999)

Microscale Heat Conduction in Integrated Circuits and Their Constituent Films (Microsystems)

1 edition

by , , and

Cover of: Microscale Heat Conduction in Integrated Circuits and Their Constituent Films (Microsystems) by Y. Sungtaek Ju, Y. Sungtaek Ju, Kenneth E. Goodson, Y. Sungtaek Ju, Kenneth E. Goodson
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Last edited by MARC Bot
July 31, 2019 | History
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An edition of Microscale heat conduction in integrated circuits and their constituent films (1999)

Microscale Heat Conduction in Integrated Circuits and Their Constituent Films (Microsystems)

1 edition

by , , and

This edition doesn't have a description yet. Can you add one?

Publish Date
Publisher
Springer
Language
English
Pages
128

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Subjects

Thin film transistors, Heat, Transmission, Semiconductors, Silicon-on-insulator technology, Cooling, Semi-conductors & super-conductors, Technology & Industrial Arts, Transistor Theory, Technology, Science/Mathematics, Mechanics - General, Electronics - Circuits - General, Engineering - Electrical & Electronic, Science : Mechanics - General, Technology / Electronics / Circuits / General, Technology / Engineering / Electrical, Technology : Engineering - Electrical & Electronic, Electronics - Semiconductors, Engineering - General, Silicon
Edition Availability
Cover of: Microscale heat conduction in integrated circuits and their constituent films
Microscale heat conduction in integrated circuits and their constituent films
1999, Kluwer Academic
in English
Cover of: Microscale heat conduction in integrated circuits and their constituent films
Microscale heat conduction in integrated circuits and their constituent films
1999, Kluwer Academic
in English
Cover of: Microscale Heat Conduction in Integrated Circuits and Their Constituent Films (Microsystems)
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films (Microsystems)
August 31, 1999, Springer
Hardcover in English - 1 edition

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Book Details

First Sentence

"Miniaturization of circuit elements has played an essential role in improving the performance, capacity, and functionality of semiconductor integrated circuits."

The Physical Object

Format
Hardcover
Number of pages
128
Dimensions
9.4 x 6.2 x 0.6 inches
Weight
5.6 ounces

Edition Identifiers

Open Library
OL7810308M
ISBN 10
0792385918
ISBN 13
9780792385912

Work Identifiers

Work ID
OL12608384W

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
July 31, 2019 Edited by MARC Bot associate edition with work OL12608384W
April 14, 2010 Edited by Open Library Bot Linked existing covers to the edition.
April 29, 2008 Created by an anonymous user Imported from amazon.com record