An edition of Wafer Bonding (2004)

Wafer Bonding

Applications and Technology

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Cover of: Wafer Bonding by Marin Alexe
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An edition of Wafer Bonding (2004)

Wafer Bonding

Applications and Technology

by

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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Publish Date
Publisher
Springer Berlin Heidelberg
Language
English
Pages
504

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Previews available in: English

Subjects
Computer engineering, Physics, Surfaces (Physics), Optical materials, Semiconductors, Electrical engineering, Characterization and Evaluation of Materials, Condensed Matter Physics, Optical and Electronic Materials, Thin Films Surfaces and Interfaces

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Cover of: Wafer Bonding
Wafer Bonding: Applications and Technology
2004, Springer Berlin Heidelberg
electronic resource : in English
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Book Details

Table of Contents

Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding
Basics of Silicon-on-Insulator (SOI) Technology
Silicon-on-Insulator by the Smart CutTM Process
ELTRAN® Technology Based on Wafer Bonding and Porous Silicon
Wafer Bonding for High-Performance Logic Applications
Application of Bonded Wafers to the Fabrication of Electronic Devices
Compound Semiconductor Heterostructures by Smart CutTM: SiC-on-Insulator, QUASICTM Substrates, InP and GaAs Heterostructures on Silicon
Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach
Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers
High-Density Hybrid Integration of III
V Compound Optoelectronics with Silicon Integrated Circuits
Layer Transfer by Bonding and Laser Lift-Off
Single-Crystal Lithium Niobate Films by Crystal Ion Slicing
Wafer Bonding of Ferroelectric Materials
Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications.

Edition Notes

Online full text is restricted to subscribers.

Also available in print.

Mode of access: World Wide Web.

Published in
Berlin, Heidelberg
Series
Springer Series in MATERIALS SCIENCE -- 75, Springer Series in MATERIALS SCIENCE -- 75

Classifications

Dewey Decimal Class
530.41
Library of Congress
QC173.45-173.458, QC1-75

The Physical Object

Format
[electronic resource] :
Pagination
1 online resource (xv, 504 p.)
Number of pages
504

ID Numbers

Open Library
OL27095006M
Internet Archive
waferbondingappl00hais
ISBN 10
3642059155, 3662108275
ISBN 13
9783642059155, 9783662108277
OCLC/WorldCat
851373471

Source records

Internet Archive item record
Better World Books record
Better World Books record
harvard_bibliographic_metadata record

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December 8, 2022 Edited by MARC Bot import existing book
February 26, 2022 Edited by ImportBot import existing book
July 8, 2019 Created by MARC Bot import new book