An edition of Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
(2021)
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
by Juan Cepeda-Rizo, Jeremiah Gayle, and Joshua Ravich
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Subjects
Electronic packaging, Electronic apparatus and appliances, Reliability, Space vehicles, Electronic equipment, Design and construction, Extreme environments, Mise sous boîtier (Électronique), Appareils électroniques, Fiabilité, Milieux extrêmes, TECHNOLOGY / Engineering / Civil, TECHNOLOGY / Engineering / Mechanical| Edition | Availability |
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1
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
2022, CRC Press LLC
in English
1032160853 9781032160856
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2
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
2021, Taylor & Francis Group
in English
1000511081 9781000511086
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3
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
2021, Taylor & Francis Group
in English
1032160810 9781032160818
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4
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
2021, Taylor & Francis Group
in English
1000511073 9781000511079
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5
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
2021, Taylor & Francis Group
in English
1003247008 9781003247005
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zzzz
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- Created December 26, 2021
- 1 revision
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| December 26, 2021 | Created by ImportBot | Imported from Better World Books record |