Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging A ...
Juan Cepeda-Rizo, Jeremiah Gay ...
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Last edited by MARC Bot
December 12, 2022 | History

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

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Publish Date
Language
English
Pages
256

Buy this book

Edition Availability
Cover of: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Cover of: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
2021, Taylor & Francis Group
in English
Cover of: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
2021, Taylor & Francis Group
in English
Cover of: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
2021, Taylor & Francis Group
in English
Cover of: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
2021, Taylor & Francis Group
in English

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Book Details


Classifications

Library of Congress
TK7870.15

Edition Identifiers

Open Library
OL33949409M
ISBN 13
9781000511086
LCCN
2021031792
OCLC/WorldCat
1268122033

Work Identifiers

Work ID
OL25340546W

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Download catalog record: RDF / JSON / OPDS | Wikipedia citation
December 12, 2022 Edited by MARC Bot import existing book
September 28, 2021 Created by ImportBot Imported from Better World Books record