An edition of Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics
(2014)
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics
Volume 612
by G. S. Oehrlein, K. Maex, S. Ogawa, J. T. Wetzel, and Y. -C Joo
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Semiconductors, Integrated circuits, Thin films| Edition | Availability |
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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612
2014, University of Cambridge ESOL Examinations
in English
110741315X 9781107413153
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- Created August 23, 2020
- 1 revision
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| August 23, 2020 | Created by ImportBot | Imported from Better World Books record |