Microelectronic packaging technology

materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989

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Microelectronic packaging technology
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Last edited by ImportBot
November 9, 2020 | History

Microelectronic packaging technology

materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Publisher
ASM International
Language
English
Pages
479

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Previews available in: English

Book Details


Edition Notes

Includes bibliographies.
Cover title: Micro electronic packaging technology.
"SAN 204-7586"--T.p. verso.

Published in
Metals Park, Ohio
Other Titles
Micro electronic packaging technology.

Classifications

Dewey Decimal Class
621.381/046
Library of Congress
TK7874 .A77 1989

The Physical Object

Pagination
xii, 479 p. :
Number of pages
479

ID Numbers

Open Library
OL2228528M
ISBN 10
0871703599
LCCN
89080612
Library Thing
1452612
Goodreads
4602840

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
January 14, 2023 Edited by ImportBot import existing book
June 24, 2022 Edited by ImportBot import existing book
November 9, 2020 Edited by MARC Bot import existing book
September 23, 2010 Edited by 72.197.185.53 Update covers
April 13, 2010 Edited by Open Library Bot Linked existing covers to the edition.