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Microelectronic packaging technology: materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989
1989, ASM International
in English
0871703599 9780871703590
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Book Details
Edition Notes
Includes bibliographies.
Cover title: Micro electronic packaging technology.
"SAN 204-7586"--T.p. verso.
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- Created April 13, 2010
- 10 revisions
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January 14, 2023 | Edited by ImportBot | import existing book |
June 24, 2022 | Edited by ImportBot | import existing book |
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September 23, 2010 | Edited by 72.197.185.53 | Update covers |
April 13, 2010 | Edited by Open Library Bot | Linked existing covers to the edition. |