Cover of: Microelectronic packaging technology by ASM International Electronic Materials and Processing Congress (2nd 1989 Philadelphia, Pa.)

Microelectronic packaging technology

materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989

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Last edited by ImportBot
June 24, 2022 | History

Microelectronic packaging technology

materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read
Publish Date
Publisher
ASM International
Language
English
Pages
479

Previews available in: English

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Book Details


Published in

Metals Park, Ohio

Edition Notes

Includes bibliographies.
Cover title: Micro electronic packaging technology.
"SAN 204-7586"--T.p. verso.

Other Titles
Micro electronic packaging technology.

Classifications

Dewey Decimal Class
621.381/046
Library of Congress
TK7874 .A77 1989

The Physical Object

Pagination
xii, 479 p. :
Number of pages
479

ID Numbers

Open Library
OL2228528M
Internet Archive
microelectronicp0000asmi
ISBN 10
0871703599
LCCN
89080612
Library Thing
1452612
Goodreads
4602840

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
June 24, 2022 Edited by ImportBot import existing book
November 9, 2020 Edited by MARC Bot import existing book
September 23, 2010 Edited by 72.197.185.53 Update covers
September 23, 2010 Edited by 72.197.185.53 Update covers
April 1, 2008 Created by an anonymous user Imported from Scriblio MARC record.