An edition of Design for Manufacturability Through Design-Process Integration III (2009)

Design for Manufacturability Through Design-Process Integration III

26-27 February 2009, San Jose, California, United States

by , , and

Design for Manufacturability Through Design-P ...
Vivek K. Singh, Michael L. Rie ...
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Last edited by Tom Morris
January 17, 2023 | History
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An edition of Design for Manufacturability Through Design-Process Integration III (2009)

Design for Manufacturability Through Design-Process Integration III

26-27 February 2009, San Jose, California, United States

by , , and

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Publish Date
Publisher
SPIE
Language
English
Pages
528

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Subjects

Integrated circuits, Semiconductors, Microelectronics industry, Quality control, Semiconductor wafers, Analysis, Design and construction, Congresses, Defects
Edition Availability
Cover of: Design for Manufacturability Through Design-Process Integration III
Design for Manufacturability Through Design-Process Integration III: 26-27 February 2009, San Jose, California, United States
2009, SPIE
in English

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Book Details

Classifications

Library of Congress
TK7874.D474978 2009, TK7874 .D474978 2009

Edition Identifiers

Open Library
OL28463702M
ISBN 13
9780819475282
LCCN
2010459384

Work Identifiers

Work ID
OL21028803W

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