Check nearby libraries
Buy this book
![Loading indicator](/images/ajax-loader-bar.gif)
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.
Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost; define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data; identify potential failure modes, sites, mechanisms, and architecture-stress interactions - PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures; characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved; and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins.
Check nearby libraries
Buy this book
![Loading indicator](/images/ajax-loader-bar.gif)
Previews available in: English
Showing 2 featured editions. View all 2 editions?
Edition | Availability |
---|---|
1
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
2008, Wiley & Sons, Incorporated, John
in English
0470360283 9780470360286
|
zzzz
Libraries near you:
WorldCat
|
2
Integrated circuit, hybrid, and multichip module package design guidelines: a focus on reliability
1994, Wiley
in English
0471594466 9780471594468
|
aaaa
Libraries near you:
WorldCat
|
Book Details
Edition Notes
Includes bibliographical references and index.
"A Wiley-Interscience publication."
Classifications
The Physical Object
ID Numbers
Community Reviews (0)
Feedback?July 25, 2024 | Edited by MARC Bot | import existing book |
October 4, 2021 | Edited by ImportBot | import existing book |
February 18, 2019 | Created by MARC Bot | import existing book |