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Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.
Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost; define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data; identify potential failure modes, sites, mechanisms, and architecture-stress interactions - PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures; characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved; and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins.
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Previews available in: English
Showing 2 featured editions. View all 2 editions?
Edition | Availability |
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1
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
2008, Wiley & Sons, Incorporated, John
in English
0470360283 9780470360286
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2
Integrated circuit, hybrid, and multichip module package design guidelines: a focus on reliability
1994, Wiley
in English
0471594466 9780471594468
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