An edition of Electromigration in thin films and electronic devices (2011)

Electromigration in thin films and electronic devices

materials and reliability

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Cover of: Electromigration in thin films and electronic devices by Choong-Un Kim
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Last edited by MARC Bot
December 19, 2022 | History
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An edition of Electromigration in thin films and electronic devices (2011)

Electromigration in thin films and electronic devices

materials and reliability

by

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Publisher
Woodhead Publishing
Language
English
Pages
340

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Previews available in: English

Subjects
Electrodiffusion, Integrated circuits, Deterioration, Thin films, Interconnects (Integrated circuit technology), Diffusion, Couches minces, TECHNOLOGY & ENGINEERING, Mechanical

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Edition Availability
Cover of: Electromigration in Thin Films and Electronic Devices
Electromigration in Thin Films and Electronic Devices: Materials and Reliability
Sep 02, 2016, Woodhead Publishing
paperback
Libraries near you: WorldCat
Cover of: Electromigration in thin films and electronic devices
Electromigration in thin films and electronic devices: materials and reliability
2011, Woodhead Publishing
in English
  • Not in Library
Libraries near you: WorldCat

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Book Details

Table of Contents

Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang
Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa
Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.

Edition Notes

Includes bibliographical references and index.

Published in
Oxford, Philadelphia
Series
Woodhead Publishing in materials, Woodhead Publishing in materials

Classifications

Library of Congress
TK7874 .E478 2011, TK7871.15.F5E4 2011, TA418.9.T45 E54 2010eb

The Physical Object

Pagination
xiii, 340 p. :
Number of pages
340

ID Numbers

Open Library
OL25214345M
Internet Archive
electromigration00kimc
ISBN 10
1845699378
ISBN 13
9781845699376, 9780857093752
LCCN
2011934923
OCLC/WorldCat
713610407, 880416293, 758543100

Source records

Library of Congress MARC record
Better World Books record
Library of Congress MARC record
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marc_columbia MARC record

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History

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December 19, 2022 Edited by MARC Bot import existing book
August 15, 2020 Edited by ImportBot import existing book
February 22, 2012 Created by LC Bot import new book