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Previews available in: English
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Edition | Availability |
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1
Electromigration in Thin Films and Electronic Devices: Materials and Reliability
Sep 02, 2016, Woodhead Publishing
paperback
0081016964 9780081016961
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2
Electromigration in thin films and electronic devices: materials and reliability
2011, Woodhead Publishing
in English
1845699378 9781845699376
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Book Details
Table of Contents
Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang
Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa
Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.
Edition Notes
Includes bibliographical references and index.
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Feedback?December 19, 2022 | Edited by MARC Bot | import existing book |
August 15, 2020 | Edited by ImportBot | import existing book |
February 22, 2012 | Created by LC Bot | import new book |