An edition of Electromigration in thin films and electronic devices (2011)

Electromigration in thin films and electronic devices

materials and reliability

by

Cover of: Electromigration in thin films and electronic devices by Choong-Un Kim, Choong-Un Kim
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Last edited by ImportBot
March 28, 2025 | History
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An edition of Electromigration in thin films and electronic devices (2011)

Electromigration in thin films and electronic devices

materials and reliability

by

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Publish Date
Publisher
Woodhead Publishing
Language
English
Pages
340

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Subjects

Electrodiffusion, Integrated circuits, Deterioration, Thin films, Interconnects (Integrated circuit technology), Diffusion, Couches minces, TECHNOLOGY & ENGINEERING, Mechanical
Edition Availability
Cover of: Electromigration in Thin Films and Electronic Devices
Electromigration in Thin Films and Electronic Devices: Materials and Reliability
Sep 02, 2016, Woodhead Publishing
paperback
Cover of: Electromigration in Thin Films and Electronic Devices
Electromigration in Thin Films and Electronic Devices: Materials and Reliability
2011, Elsevier Science & Technology
in English
Cover of: Electromigration in thin films and electronic devices
Electromigration in thin films and electronic devices: materials and reliability
2011, Woodhead Publishing
in English

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Book Details

Table of Contents

Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang
Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa
Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.

Edition Notes

Includes bibliographical references and index.

Published in
Oxford, Philadelphia
Series
Woodhead Publishing in materials, Woodhead Publishing in materials

Classifications

Library of Congress
TK7874 .E478 2011, TK7871.15.F5E4 2011, TA418.9.T45 E54 2010eb

The Physical Object

Pagination
xiii, 340 p. :
Number of pages
340

Edition Identifiers

Open Library
OL25214345M
ISBN 10
1845699378
ISBN 13
9781845699376, 9780857093752
LCCN
2011934923
OCLC/WorldCat
713610407, 880416293, 758543100

Work Identifiers

Work ID
OL16521129W

Source records

Library of Congress MARC record
Better World Books record
Library of Congress MARC record
Better World Books record
Harvard University record
marc_columbia MARC record

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
March 28, 2025 Edited by ImportBot Redacting ocaids
December 19, 2022 Edited by MARC Bot import existing book
December 7, 2022 Edited by MARC Bot import existing book
November 18, 2022 Edited by ImportBot import existing book
February 22, 2012 Created by LC Bot Imported from Library of Congress MARC record