An edition of Wafer-Level Chip-Scale Packaging (2014)

Wafer-Level Chip-Scale Packaging

Analog and Power Semiconductor Applications

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Wafer-Level Chip-Scale Packaging
Shichun Qu, Liu, Yong, Shichun ...
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Last edited by ImportBot
March 1, 2022 | History
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An edition of Wafer-Level Chip-Scale Packaging (2014)

Wafer-Level Chip-Scale Packaging

Analog and Power Semiconductor Applications

by and

This edition doesn't have a description yet. Can you add one?

Publish Date
Publisher
Springer
Language
English

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Subjects

Electronic packaging
Edition Availability
Cover of: Wafer-Level Chip-Scale Packaging
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Aug 23, 2016, Springer
paperback
Cover of: Wafer-Level Chip-Scale Packaging
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
2014, Springer
in English
Cover of: Wafer-Level Chip-Scale Packaging
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Sep 11, 2014, Springer
paperback
Cover of: Wafer-Level Chip-Scale Packaging
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
2014, Springer
in English

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Book Details

Classifications

Library of Congress
TK7800-8360

The Physical Object

Pagination
xvii, 322

Edition Identifiers

Open Library
OL37414165M
ISBN 13
9781493915569

Work Identifiers

Work ID
OL20675378W

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March 1, 2022 Created by ImportBot Imported from Better World Books record