An edition of Application of Fracture Mechanics in Electronic Packaging and Materials
(1995)
Application of fracture mechanics in electronic packaging and materials
presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
by Ga.) International Mechanical Engineerin...
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| Edition | Availability |
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1
Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and Exposition ... Francisco, California (Eep (Series), V. 11.)
June 1995, American Society of Mechanical Engineers
Paperback
in English
0791817369 9780791817360
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2
Application of fracture mechanics in electronic packaging and materials: presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
1995, American Society of Mechanical Engineers
in English
0791817369 9780791817360
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aaaa
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Book Details
Edition Notes
Includes bibliographical references and index.
Papers presented at a symposium held during the 1995 ASME International Mechancial Engineering Congress and Exposition.
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