An edition of Application of Fracture Mechanics in Electronic Packaging and Materials
(1995)
Application of Fracture Mechanics in Electronic Packaging and Materials
Presented at the 1995 Asme International Mechanical Engineering Congress and Exposition ... Francisco, California (Eep (Series), V. 11.)
by Ga.) International Mechanical Engineerin...
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Publish Date
June 1995
Publisher
American Society of Mechanical Engineers
Language
English
Pages
271
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Previews available in: English
| Edition | Availability |
|---|---|
1
Application of fracture mechanics in electronic packaging and materials: presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
1995, American Society of Mechanical Engineers
in English
0791817369 9780791817360
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2
Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and Exposition ... Francisco, California (Eep (Series), V. 11.)
June 1995, American Society of Mechanical Engineers
Paperback
in English
0791817369 9780791817360
|
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|
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- Created April 29, 2008
- 8 revisions
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| January 14, 2023 | Edited by ImportBot | import existing book |
| May 31, 2022 | Edited by ImportBot | import existing book |
| March 1, 2022 | Edited by ImportBot | import existing book |
| November 20, 2020 | Edited by MARC Bot | import existing book |
| April 29, 2008 | Created by an anonymous user | Imported from amazon.com record |