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Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more.
For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.
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Subjects
Semiconductors, Bonding, Semiconductor wafersShowing 2 featured editions. View all 2 editions?
Edition | Availability |
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1
Semiconductor wafer bonding: science and technology
1999, John Wiley
in English
0471574813 9780471574811
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WorldCat
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2
SemiConductor Wafer Bonding: Science and Technology
November 23, 1998, Wiley-Interscience
in English
0471574813 9780471574811
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Libraries near you:
WorldCat
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Book Details
Edition Notes
"Sponsored by the Electrochemical Society, Inc., Pennington, New Jersey."
Includes index.
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The Physical Object
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- Created April 1, 2008
- 8 revisions
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July 16, 2024 | Edited by MARC Bot | import existing book |
October 5, 2021 | Edited by ImportBot | import existing book |
November 28, 2020 | Edited by MARC Bot | import existing book |
April 14, 2010 | Edited by Open Library Bot | Linked existing covers to the edition. |
April 1, 2008 | Created by an anonymous user | Imported from Scriblio MARC record |