An edition of Chip scale package (CSP)
(1999)
Chip Scale Package
Design, Materials, Process, Reliability, and Applications
by John H. Lau, Ricky S.W. Lee, and Ricky S. Lee
- 0 Ratings
- 0 Want to read
- 0 Currently reading
- 0 Have read
Share
×Close
This edition doesn't have a description yet. Can you add one?
Check nearby libraries
Buy this book
Previews available in: English
Showing 2 featured editions. View all 2 editions?
| Edition | Availability |
|---|---|
1
Chip Scale Package: Design, Materials, Process, Reliability, and Applications
February 28, 1999, McGraw-Hill Professional
in English
0070383049 9780070383043
|
aaaa
Libraries near you:
WorldCat
|
2
Chip Scale Package: Design, Materials, Process, Reliability, and Applications
February 28, 1999, McGraw-Hill Professional
Hardcover
in English
- 1 edition
0070383049 9780070383043
|
zzzz
Libraries near you:
WorldCat
|
Book Details
Classifications
ID Numbers
Community Reviews (0)
Feedback?
History
- Created April 29, 2008
- 10 revisions
Wikipedia citation
×CloseCopy and paste this code into your Wikipedia page. Need help?
| November 28, 2020 | Edited by MARC Bot | import existing book |
| October 10, 2020 | Edited by ImportBot | import existing book |
| August 4, 2020 | Edited by ImportBot | import existing book |
| June 29, 2019 | Edited by MARC Bot | import existing book |
| April 29, 2008 | Created by an anonymous user | Imported from amazon.com record. |