An edition of Chip Scale Package
Chip Scale Package
Design, Materials, Process, Reliability, and Applications
by John H. Lau, Ricky S.W. Lee, and Ricky S. Lee
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Chip Scale Package: Design, Materials, Process, Reliability, and Applications
February 28, 1999, McGraw-Hill Professional
in English
0070383049 9780070383043
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- Created June 29, 2019
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| November 28, 2020 | Edited by MARC Bot | import existing book |
| October 10, 2020 | Edited by ImportBot | import existing book |
| August 4, 2020 | Edited by ImportBot | import existing book |
| June 29, 2019 | Edited by MARC Bot | import existing book |
| June 29, 2019 | Edited by MARC Bot | import existing book |