An edition of Three-dimensional molded interconnect devices (3D-MID)
(2014)
Three-dimensional molded interconnect devices (3D-MID)
materials, manufacturing, assembly, and applications for injection molded circuit carriers
by Franke, Jörg Dipl.-Ing
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Subjects
Interconnects (Integrated circuit technology), Design and construction, Injection molding of plastics, Integrated circuits, Plastics, molding, Matières plastiques, Moulage par injection, Injection molding, TECHNOLOGY & ENGINEERING, Mechanical, Electrical & Computer Engineering, Engineering & Applied Sciences, Electrical Engineering| Edition | Availability |
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Three-dimensional molded interconnect devices (3D-MID): materials, manufacturing, assembly, and applications for injection molded circuit carriers
2014, Hanser Publishers, Hanser Publications
in English
1569905517 9781569905517
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Book Details
Edition Notes
Includes bibliographical references (pages 307-323) and index.
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- Created November 12, 2020
- 5 revisions
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| April 10, 2023 | Edited by ImportBot | import existing book |
| December 22, 2022 | Edited by MARC Bot | import existing book |
| December 19, 2022 | Edited by MARC Bot | import existing book |
| February 26, 2022 | Edited by ImportBot | import existing book |
| November 12, 2020 | Created by MARC Bot | Imported from Library of Congress MARC record |