An edition of Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
(2009)
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
28-29 January 2009, San Jose, California, United States
by Richard C. Kullberg, Rajeshuni Ramesham, SPIE, and Texas Instruments Incorporated Staff
- 0 Ratings
- 0 Want to read
- 0 Currently reading
- 0 Have read
Share
×Close
Check nearby libraries
Buy this book
Last edited by Tom Morris
January 17, 2023 | History
This edition doesn't have a description yet. Can you add one?
Check nearby libraries
Buy this book
Showing 1 featured edition. View all 1 editions?
| Edition | Availability |
|---|---|
1
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII: 28-29 January 2009, San Jose, California, United States
2009, SPIE
in English
0819474525 9780819474520
|
aaaa
Libraries near you:
WorldCat
|
Book Details
Classifications
ID Numbers
Source records
Community Reviews (0)
Feedback?
History
- Created August 2, 2020
- 3 revisions
Wikipedia citation
×CloseCopy and paste this code into your Wikipedia page. Need help?
| January 17, 2023 | Edited by Tom Morris | merge authors |
| November 14, 2020 | Edited by MARC Bot | import existing book |
| August 2, 2020 | Created by ImportBot | Imported from Better World Books record |