| Record ID | marc_loc_2016/BooksAll.2016.part37.utf8:191899699:1510 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part37.utf8:191899699:1510?format=raw |
LEADER: 01510cam a22003377a 4500
001 2010287640
003 DLC
005 20101013083246.0
008 100505s2009 waua b 101 0 eng d
010 $a 2010287640
020 $a9780819474520
020 $a0819474525
035 $a(OCoLC)ocn318453836
040 $aLHL$cLHL$dDLC
042 $alccopycat
050 00 $aTK7875$b.R438 2009
082 00 $a621.381$222
245 00 $aReliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices VIII :$b28-29 January 2009, San Jose, California, United States /$cRichard C. Kullberg, Rajeshuni Ramesham, editors ; sponsored [and] published by SPIE ; symposium cosponsors, Texas Instruments Inc. (United States) ... [et al.].
260 $aBellingham, Wash. :$bSPIE,$cc2009.
300 $a1 v. (various pagings) :$bill. ;$c28 cm.
490 1 $aProceedings of SPIE,$x0277-786X ;$vv. 7206
500 $aSome previous conferences entitled: Reliability, packaging, testing, and characterization of MEMS/MOEMS.
504 $aIncludes bibliographical references.
650 0 $aMicroelectromechanical systems$xReliability$vCongresses.
650 0 $aMicroelectromechanical systems$xTesting$vCongresses.
650 0 $aMicroelectronic packaging$vCongresses.
700 1 $aKullberg, Richard C.
700 1 $aRamesham, Rajeshuni.
710 2 $aSPIE (Society)
710 2 $aTexas Instruments Incorporated.
830 0 $aProceedings of SPIE--the International Society for Optical Engineering ;$vv. 7206.