An edition of Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX (2010)

Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX

25-26 January 2010, San Francisco, California, United States

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Reliability, packaging, testing, and characte ...
Richard C. Kullberg, Rajeshuni ...
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Last edited by MARC Bot
October 12, 2020 | History
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An edition of Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX (2010)

Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX

25-26 January 2010, San Francisco, California, United States

by and

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Publisher
SPIE
Language
English

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Subjects
Reliability, Microelectromechanical systems, Testing, Congresses, Microelectronic packaging

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Edition Availability
Cover of: Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX
Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX: 25-26 January 2010, San Francisco, California, United States
2010, SPIE
in English
  • Not in Library
Libraries near you: WorldCat

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Book Details

Edition Notes

Includes bibliographical references.

Published in
Bellingham, Wash
Series
Proceedings of SPIE -- v. 7592, Proceedings of SPIE--the International Society for Optical Engineering -- v. 7592.

Classifications

Library of Congress
TK7875 .R438 2010

The Physical Object

Pagination
1 v. (various pagings) :

ID Numbers

Open Library
OL25202755M
ISBN 10
0819479888
ISBN 13
9780819479884
LCCN
2011293397
OCLC/WorldCat
642855931

Source records

Library of Congress MARC record
Library of Congress MARC record
Library of Congress MARC record

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
October 12, 2020 Edited by MARC Bot import existing book
March 15, 2012 Edited by LC Bot import new book
February 15, 2012 Created by LC Bot Imported from Library of Congress MARC record