| Record ID | marc_loc_2016/BooksAll.2016.part38.utf8:246127161:1279 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part38.utf8:246127161:1279?format=raw |
LEADER: 01279cam a22003137a 4500
001 2011293397
003 DLC
005 20120302083114.0
008 111024s2010 waua b 100 0 eng d
010 $a 2011293397
020 $a9780819479884 (pbk.)
020 $a0819479888 (pbk.)
035 $a(OCoLC)ocn642855931
040 $aCAI$cCAI$dDLC
042 $alccopycat
050 00 $aTK7875$b.R438 2010
082 00 $a621.381$223
245 00 $aReliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX :$b25-26 January 2010, San Francisco, California, United States /$cRichard C. Kullberg, Rajeshuni Ramesham, editors ; sponsored and published by SPIE.
260 $aBellingham, Wash. :$bSPIE,$cc2010.
300 $a1 v. (various pagings) :$bill. ;$c28 cm.
490 1 $aProceedings of SPIE,$x0277-786X ;$vv. 7592
504 $aIncludes bibliographical references.
650 0 $aMicroelectromechanical systems$xReliability$vCongresses.
650 0 $aMicroelectromechanical systems$xTesting$vCongresses.
650 0 $aMicroelectronic packaging$vCongresses.
700 1 $aKullberg, Richard C.
700 1 $aRamesham, Rajeshuni.
710 2 $aSPIE (Society)
830 0 $aProceedings of SPIE--the International Society for Optical Engineering ;$vv. 7592.