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Subjects
Congresses, Design and construction, Semiconductors, Etching, Integrated circuits, Plasma etching, Copper, Dielectric devices, Dielectrics, Electric conductivity, Electric contacts, Electrochemical metallizing, Industrial applications, Lasers, Materials, Plasma-enhanced chemical vapor deposition, Reliability, Semiconductor wafers, Sputtering (Physics), Thin film devices, Thin films, Ultra large scale integrationID Numbers
- OLID: OL3058524A
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April 30, 2008 | Created by an anonymous user | initial import |