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Last edited anonymously
April 29, 2008 | History
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Katsuaki Suganuma

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5 works Add another?

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  • Cover of: Lead-free soldering in electronics: science, technology and environmental impact

    First published in 2003 7 editions in 1 language — 1 previewable
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  • Cover of: Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability

    First published in 2018 2 editions in 1 language
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  • Cover of: Introduction to Printed Electronics

    First published in 2014 2 editions in 1 language
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  • Cover of: Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact

    First published in 2003 2 editions in 1 language — 1 previewable
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  • Cover of: Kinzoku nano ryūshi inku no haisen gijutsu: inkujetto gijutsu o chūshin ni = Wiring technology of metallic nano particle ink : ink-jet technology

    First published in 2011 1 edition in 1 language
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We need a photo of Katsuaki Suganuma

Subjects
Electronic packaging, Printed circuits, Solder and soldering, Design and construction, Digital, Electronic apparatus and appliances, Electronics, Engineering, Green electronics, Ink-jet printing, Lead-free electronics manufacturing processes, Microelectronics, Mise sous boîtier (Électronique), Nanoparticles, Nanotechnology, Nonfiction, Semiconductors, Solder, Solid state electronics, Soudure, TECHNOLOGY & ENGINEERING

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ID Numbers

  • OLID: OL2870948A

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History

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April 29, 2008 Created by an anonymous user initial import