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Last edited anonymously
April 29, 2008 | History
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IEEE Components Packaging & Manufacturin

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  • Cover of: Proceedings of the 1999 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits

    First published in 1999 — 3 editions
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  • Cover of: Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium: March 5-7, 1996, Four Seasons Hotel, Austin, TX, USA

    First published in 1996 — 3 editions
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  • Cover of: IEEE 50th Electronic Components and Technology Conference 2000

    First published in 2000 — 2 editions
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  • Cover of: Twenty first IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA

    First published in 1997 — 2 editions
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  • Cover of: Electrical Performance of Electronic Packaging: October 27-29, 1997 : The Wyndham Hotel San Jose, California

    First published in 1997 — 2 editions
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  • Cover of: Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium

    First published in 2000 — 2 editions
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  • Cover of: Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium: Proceedings 1997 Austin, Tx, Usa, January 28-30, 1997

    First published in 1997 — 2 editions
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  • Cover of: Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), 1998 IEEE

    First published in 1998 — 2 editions
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  • Cover of: IEEE/Semi Advanced Semiconductor Manufactoring Conference & Workshop (Asmc) Proceedings

    First published in 2000 — 2 editions
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  • Cover of: IEEE/SEMI International Semiconductor Manufacturing Science Symposium: July 19-20, 1993, San Francisco, CA USA.

    First published in 1993 — 2 editions
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  • Cover of: 1994 44th Electronic Components & Technology Conference/94Ch3241-7 (Electronic Components and Technology Conference//Proceedings)

    First published in 1994 — 1 edition
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  • Cover of: 1995 Japan Iemt Symposium: Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium : December 4-6, 1995 Omiya, Japan

    First published in 1996 — 1 edition
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  • Cover of: 1996 IEEE 46th Electronic Components and Technology Conference (Ectc

    First published in 1997 — 1 edition
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  • Cover of: 1996 Proceedings 46th Electronic Components & Technology Conference (IEEE Conference Publications. Ch Series)

    First published in 1996 — 1 edition
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  • Cover of: 2000 IEEE 16th Annual Semiconductor Thermal Measurementand Management Symp Osium (Semi-Therm)

    First published in 2000 — 1 edition
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  • Cover of: Electrical Contacts 1997: Proceedings of the Forty-Third IEEE Holm Conference on Electrical Contacts

    First published in 1997 — 1 edition
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  • Cover of: Electronic Components and Technology Conference Proceedings

    First published in 2000 — 1 edition
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  • Cover of: Eleventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium

    First published in 1995 — 1 edition
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  • Cover of: Fifteenth International Conference on Thermoelectrics: Proceedings Ict '96 : March 26-29, 1996, Pasadena, Ca USA

    First published in 1996 — 1 edition
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  • Cover of: IEEE 50th Electronic Components and Technology Conference 2000 (Electronic Components and Technology Conference//Proceedings)
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    First published in 2001 — 1 edition
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Subjects

Congresses, Technology & Industrial Arts, Semiconductors, Engineering - Electrical & Electronic, Science/Mathematics, Cooling, Electricity, Semi-conductors & super-conductors, Technology, Thermal properties, Design and construction, Electronic industries, Electronic packaging, Electronics - General, Electronics - Semiconductors, Circuits & components, Electronic apparatus and appliances, Electronics engineering, Microelectronics, Technology & Engineering, Analytical chemistry, Computer Books: General, Computer Integrated Manufacturing (Cim), Computer integrated manufacturing systems, Condensed matter physics (liquids & solids)

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ID Numbers

  • OLID: OL2858142A

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History

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April 29, 2008 Created by an anonymous user initial import