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Last edited anonymously
April 29, 2008 | History
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King-Ning Tu

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  • Cover of: Kinetics in Nanoscale Materials

    First published in 2014 — 6 editions
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  • Cover of: Electronic Thin Film Reliability

    First published in 2010 — 5 editions
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  • Cover of: Electronic Packaging Science and Technology

    First published in 2021 — 4 editions
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  • Cover of: Elements of Electromigration: Electromigration in 3D IC Technology

    First published in 2024 — 3 editions
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  • Cover of: Electronic thin film science: for electrical engineers and materials scientists
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    First published in 1992 — 3 editions
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  • Cover of: Silicon and Silicide Nanowires: Applications, Fabrication, and Properties

    First published in 2013 — 3 editions
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  • Cover of: Phase transitions in condensed systems: experiments and theory : festschrift in honor of David Turnbull on the occasion of his seventieth birthday : symposium held December 5-6, 1985, Boston, Massachusetts, U.S.A.

    First published in 1987 — 2 editions
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  • Cover of: Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science) (Springer Series in Materials Science)

    First published in 2007 — 2 editions
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  • Cover of: Phase Transitions in Condensed Systems - Experiments and Theory

    First published in 2014 — 1 edition
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Subjects

Condensed matter, Solid state physics, Analysis, Chemical kinetics, Chemistry, Computer simulation, Condensed Matter Physics, Congresses, Electric engineering, Electrical engineering, Inorganic, Materials, Metals, Multilayered Thin films, Nanostructured materials, Nanowires, Phase transformations (Statist, Phase transformations (Statistical physics), Phase transformations (statistical physics), Reliability, SCIENCE, Science/Mathematics, Silicides, Silicon, Solder and soldering

People

David Turnbull (1915-)

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ID Numbers

  • OLID: OL2625129A

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History

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April 29, 2008 Created by an anonymous user initial import