Manufacturing Process and Materials Challenges in Microelectronic Packaging

Presented at the Winter Annual Meeting of the American Society of Mechanical ... December 1-6, 1991 (Amd (Series), V. 131.)

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December 10, 2009 | History

Manufacturing Process and Materials Challenges in Microelectronic Packaging

Presented at the Winter Annual Meeting of the American Society of Mechanical ... December 1-6, 1991 (Amd (Series), V. 131.)

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Language
English
Pages
153

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Book Details


The Physical Object

Format
Paperback
Number of pages
153
Dimensions
11.2 x 8.8 x 0.5 inches
Weight
13.6 ounces

ID Numbers

Open Library
OL7804162M
ISBN 10
0791808963
ISBN 13
9780791808962
Goodreads
3571597

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December 10, 2009 Created by WorkBot add works page