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Last edited by Open Library Bot
December 4, 2010 | History
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Previews available in: English
Subjects
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Electronic packaging: materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge, Massachusetts, USA
1992, ASM International, Asm Intl
in English
0871704498 9780871704498
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Book Details
Edition Notes
Includes bibliographical refrences.

