An edition of Thermoplastic compounds for solderable electronic interconnect devices (1991)

Thermoplastic compounds for solderable electronic interconnect devices

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Thermoplastic compounds for solderable electr ...
Williams, David J.
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Last edited by Open Library Bot
December 4, 2010 | History
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An edition of Thermoplastic compounds for solderable electronic interconnect devices (1991)

Thermoplastic compounds for solderable electronic interconnect devices

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  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Publisher
PST Group
Language
English
Pages
229

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Subjects
Heat resistant plastics, Surface mount technology, Thermoplastics

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Edition Availability
Cover of: Thermoplastic compounds for solderable electronic interconnect devices
Thermoplastic compounds for solderable electronic interconnect devices
1991, PST Group
in English
  • Not in Library

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Book Details

Edition Notes

Includes bibliographical references.

Published in
Littleton, MA, USA (311 Great Rd., Littleton 01460)

Classifications

Dewey Decimal Class
621.3815/31
Library of Congress
TK7868.P7 W53 1991

The Physical Object

Pagination
xiv, 229 p. :
Number of pages
229

ID Numbers

Open Library
OL1626347M
LCCN
91173195

Source records

Library of Congress MARC record

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History

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December 4, 2010 Edited by Open Library Bot Added subjects from MARC records.
December 10, 2009 Created by WorkBot add works page