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An edition of Multilayer ceramic substrate-technology for VLSI package/multichip module (1993)

Multilayer ceramic substrate-technology for VLSI package/multichip module

English language ed.

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Cover of: Multilayer ceramic substrate-technology for VLSI package/multichip module by Kanji Ōtsuka, Kanji Ōtsuka
Multilayer ceramic substrate-technology for VLSI package/multichip module by Kanji Ōtsuka, Kanji Ōtsuka
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Last edited by ImportBot
February 25, 2022 | History
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An edition of Multilayer ceramic substrate-technology for VLSI package/multichip module (1993)

Multilayer ceramic substrate-technology for VLSI package/multichip module

English language ed.

by

  • 1 Want to read

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Publish Date
Publisher
Elsevier Applied Science
Language
English
Pages
242

Subjects

Aluminum oxide Design and construction Electronic ceramics Electronic packaging Integrated circuits Materials Very large scale integration Integrated circuits, very large scale integration
Edition Availability
Cover of: Multilayer ceramic substrate-technology for VLSI package/multichip module
Multilayer ceramic substrate-technology for VLSI package/multichip module
1993, Elsevier Applied Science
in English - English language ed.
  • Nearby Libraries

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Book Details

Edition Notes

Includes bibliographical references (p. 223-231) and index.
Translation of: Seramikku tasō haisen kiban.

Published in
London, New York
Series
Ceramic research and development in Japan

Classifications

Dewey Decimal Class
621.39/5
Library of Congress
TK7871.15.C4 O8813 1991, TA455.C43

The Physical Object

Pagination
xiii, 242 p. :
Number of pages
242

Edition Identifiers

Open Library
OL1541634M
ISBN 10
185166579X
LCCN
91020387
OCLC/WorldCat
23869570
Goodreads
3506623

Work Identifiers

Work ID
OL4094426W

Source records

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