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An edition of Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications (1993)

Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

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Cover of: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications by International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (2nd 1993 Honolulu, Hawaii), International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (2nd 1993 Honolulu, Hawaii)
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Last edited by Open Library Bot
December 4, 2010 | History
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An edition of Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications (1993)

Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

by

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Publish Date
Publisher
Electrochemical Society
Language
English
Pages
485

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Subjects

Bonding Congresses Semiconductor wafers Semiconductors
Edition Availability
Cover of: Semiconductor Waffer Bonding Science Technology and Application (Proceedings / Electrochemical Society)
Semiconductor Waffer Bonding Science Technology and Application (Proceedings / Electrochemical Society)
December 1993, Electrochemical Society
Paperback in English - 2 edition
Cover of: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications
Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications
1993, Electrochemical Society
in English

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Book Details

Edition Notes

Includes bibliographical references and indexes.
Symposium held at the Hawaii meeting of The Electrochemical Society, May 16-21, 1993.

Published in
Pennington, NJ
Series
Proceedings / Electrochemical Society ;, v. 93-29, Proceedings (Electrochemical Society) ;, v. 93-29.
Other Titles
Semiconductor wafer bonding: science, technology, and applications.

Classifications

Dewey Decimal Class
621.3815/2
Library of Congress
TK7871.85 .I5838 1993

The Physical Object

Pagination
x, 485 p. :
Number of pages
485

Edition Identifiers

Open Library
OL1439290M
ISBN 10
1566770688
LCCN
93070070
OCLC/WorldCat
29779238

Work Identifiers

Work ID
OL3964833W

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