An edition of The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
(1999)
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
1 edition
by Gerard Kelly
- 0 Ratings
- 0 Want to read
- 0 Currently reading
- 0 Have read
Share
×Close
"This book is motivated by the need to understand and predict the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. Failures like delaminations, package cracking, and metal shift occur due to the build up of residual stress and warpage in the packages because of the TCE mismatch between the package materials as the package cools from its molding temperature to room temperature.
The correct use of finite element tools for these problems is emphasised."--BOOK JACKET.
Check nearby libraries
Buy this book
Showing 1 featured edition. View all 1 editions?
| Edition | Availability |
|---|---|
1
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
April 30, 1999, Springer
Hardcover
in English
- 1 edition
0792384857 9780792384854
|
aaaa
Libraries near you:
WorldCat
|
Book Details
Classifications
The Physical Object
ID Numbers
Community Reviews (0)
Feedback?
| July 17, 2024 | Edited by MARC Bot | import existing book |
| December 29, 2021 | Edited by ImportBot | import existing book |
| November 30, 2020 | Edited by MARC Bot | import existing book |
| April 28, 2010 | Edited by Open Library Bot | Linked existing covers to the work. |
| December 10, 2009 | Created by WorkBot | add works page |