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Subjects
Heat, Congresses, Conduction, Measurement, Methodology, Materials, Thermal properties, Expansion (Heat)Showing 1 featured edition. View all 1 editions?
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Thermal conductivity 33: thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA
2018, DEStech Publications
in English
1605955353 9781605955353
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Includes bibliographical references and author index.
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