An edition of Area Array Package Design (2003)

Area Array Package Design

Techniques in High Density Electronics

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Last edited by MARC Bot
December 8, 2020 | History
An edition of Area Array Package Design (2003)

Area Array Package Design

Techniques in High Density Electronics

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Publish Date
Language
English
Pages
204

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Previews available in: English

Edition Availability
Cover of: Area Array Package Design
Area Array Package Design
Oct 24, 2003, McGraw-Hill
paperback
Cover of: Area Array Package Design
Area Array Package Design: Techniques in High Density Electronics
October 24, 2003, McGraw-Hill Professional
Hardcover in English - 1 edition
Cover of: Area Array Package Design
Area Array Package Design: Techniques in High Density Electronics
October 24, 2003, McGraw-Hill Professional
in English

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Book Details


First Sentence

"The ideal electronic package is an economical and manufacturable electromechanical platform for one or more electronic devices that affords protection, facilitates handling, and provides the geometric translations and compatible interface required for connection to the next system level by practical assembly processes."

Classifications

Library of Congress
TK7870.15 .A74 2004, TK7870.16

Edition Identifiers

Open Library
OL7300245M
Internet Archive
areaarraypackage0000unse
ISBN 10
0071428275
ISBN 13
9780071428279
LCCN
2003069085
Goodreads
4268851

Work Identifiers

Work ID
OL3170557W

Excerpts

The ideal electronic package is an economical and manufacturable electromechanical platform for one or more electronic devices that affords protection, facilitates handling, and provides the geometric translations and compatible interface required for connection to the next system level by practical assembly processes.
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