An edition of Reliability and yield problems of wire bonding in microelectronics (1989)

Reliability and yield problems of wire bonding in microelectronics

the application of materials and interface science

by

Cover of: Reliability and yield problems of wire bonding in microelectronics by George G. Harman, George G. Harman
Locate

My Reading Lists:

Create a new list

Check nearby libraries

Buy this book

Last edited by ImportBot
April 4, 2023 | History
Edit
An edition of Reliability and yield problems of wire bonding in microelectronics (1989)

Reliability and yield problems of wire bonding in microelectronics

the application of materials and interface science

by

This work doesn't have a description yet. Can you add one?

Publish Date
Publisher
International Society for Hybrid Microelectronics, Intl Society of Hybrid
Language
English
Pages
202

Check nearby libraries

Buy this book

Subjects

Electronic packaging Failure Reliability Defects Semiconductors Production control Wire bonding (Electronic packaging) Failures
Edition Availability
Cover of: Reliability and yield problems of wire bonding in microelectronics
Reliability and yield problems of wire bonding in microelectronics: the application of materials and interface science
1989, International Society for Hybrid Microelectronics, Intl Society of Hybrid
in English

Add another edition?

Book Details

Edition Notes

Includes bibliographical references.
"A technical monograph of the International Society for Hybrid Microelectronics"--Cover.

Published in
Reston, Va

Classifications

Dewey Decimal Class
621.381/5
Library of Congress
TK7874 .H387 1989

The Physical Object

Pagination
xiii, 202 p. :
Number of pages
202

Edition Identifiers

Open Library
OL2229131M
ISBN 10
0930815254
LCCN
89081529
Goodreads
3581322

Work Identifiers

Work ID
OL2674502W

Source records

Community Reviews (0)

No community reviews have been submitted for this work.

Lists

Download catalog record: RDF / JSON