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The USDA Forest Products Laboratory sponsored the 6th International Symposium: Moisture and Creep Effects on Paper, Board and Containers at the Monona Terrace Convention Center, Madison, WI, USA on 14-15 July 2009. Attendees heard 20 technical presentations; presenters were from seven different countries and three continents. Session topics included Corrugated Performance, Moisture Flow, Component Behavior, Industry Efforts, Other Materials, Moisture and Creep Response.
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Subjects
Paper products, Mechanical properties, Congresses, Creep, MoistureShowing 2 featured editions. View all 2 editions?
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1
Proceedings, sixth international symposium: moisture and creep effects on paper, board, and containers : Madison, Wisconsin, USA, 14-15 July 2009
2011, U.S. Dept. of Agriculture, Forest Service, Forest Products Laboratory
electronic resource :
in English
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2
Proceedings, sixth international symposium: moisture and creep effects on paper, board and containers
2011, U.S. Dept. of Agriculture, Forest Service, Forest Products Laboratory
in English
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WorldCat
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Book Details
Table of Contents
Edition Notes
"February, 2011."--P. [2] of cover.
"Organized by the U.S. Forest Service, Forest Products Laboratory (FPL). Sponsors: TAPPI, International Paper Physics Committee."
Includes bibliographical references.
Also available on the World Wide Web.
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