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This book gives the reader insight in how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
As a comprehensive guide for the start of research and to help in performing high-frequency measurements, important notions in high-frequency characterization such as S-parameters, calibration, probing de-embedding and measurement-based modeling are explained. The techniques described are illustrated with several up-to-date examples.
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Subjects
System analysis, Electronic packagingShowing 1 featured edition. View all 1 editions?
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High-frequency characterization of electronic packaging
1998, Kluwer Academic Publishers
in English
0792383079 9780792383079
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Edition Notes
Includes bibliographical references and index.
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