High-frequency characterization of electronic packaging

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Last edited by MARC Bot
July 15, 2024 | History

High-frequency characterization of electronic packaging

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This book gives the reader insight in how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled especially in performing accurate measurements on modern IC-packages and in determination of circuit models.

As a comprehensive guide for the start of research and to help in performing high-frequency measurements, important notions in high-frequency characterization such as S-parameters, calibration, probing de-embedding and measurement-based modeling are explained. The techniques described are illustrated with several up-to-date examples.

Publish Date
Language
English
Pages
158

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Edition Availability
Cover of: High-frequency characterization of electronic packaging
High-frequency characterization of electronic packaging
1998, Kluwer Academic Publishers
in English

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Book Details


Edition Notes

Includes bibliographical references and index.

Published in
Boston
Series
Electronic packaging and interconnects series

Classifications

Dewey Decimal Class
621.381/046
Library of Congress
TK7870.15 .M37 1998, TK5101-5105.9

The Physical Object

Pagination
xii, 158 p. :
Number of pages
158

ID Numbers

Open Library
OL377318M
ISBN 10
0792383079
LCCN
98039319
OCLC/WorldCat
39714480
Library Thing
628224
Goodreads
4026433

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History

Download catalog record: RDF / JSON
July 15, 2024 Edited by MARC Bot import existing book
April 28, 2010 Edited by Open Library Bot Linked existing covers to the work.
February 1, 2010 Edited by WorkBot add more information to works
December 9, 2009 Created by WorkBot add works page