Design, test, integration and packaging of MEMS/MOEMS 2003

DTIP 2003 : 5-7 May, 2003, Cannes, France

Design, test, integration and packaging of ME...
Keren Bergman
Design, test, integration and packaging of MEMS/MOEMS 2003 by Keren Bergman
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Design, test, integration and packaging of MEMS/MOEMS 2003

DTIP 2003 : 5-7 May, 2003, Cannes, France

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Publish Date
Publisher
IEEE
Language
English
Pages
411

Book Details


Edition Notes

Includes bibliographical references and partial author index.
"IEEE Catalog Number 03EX713"--T.p. verso.
"2003 proceedings, Fifth Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS"--T.p. verso.

Published in
Piscataway, N.J
Genre
Congresses.
Other Titles
DTIP 2003

Classifications

Dewey Decimal Class
621.381
Library of Congress
TK7874 .D4756 2003

The Physical Object

Pagination
xi, 411 p. :
Number of pages
411

Edition Identifiers

Open Library
OL3325737M
ISBN 10
078037066X
LCCN
2004299331
OCLC/WorldCat
54381468
Goodreads
3318736

Work Identifiers

Work ID
OL19477331W

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