An edition of Materials, integration and packaging issues for high-frequency devices
(2004)
Materials, integration and packaging issues for high-frequency devices
symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A.
by C. Hoffmann
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Materials, Congresses, Electronic packaging| Edition | Availability |
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Materials, integration and packaging issues for high-frequency devices: symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A.
2004, Materials Research Society
in English
1558997210 9781558997219
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Book Details
Edition Notes
Includes bibliographical references and indexes.
"This volume is a collection of half of the papers given at Symposium B, the first MRS symposium on 'Materials, Integration and Packaging Issues for High-Frequency Devices,' held December 1-3 at the 2003 MRS Fall Meeting in Boston, Massachusetts."--P. xi.
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| August 1, 2020 | Edited by ImportBot | import existing book |
| February 18, 2019 | Created by MARC Bot | import existing book |