An edition of Photonics packaging, integration, and interconnects VII (2007)

Photonics packaging, integration, and interconnects VII

23-25 January, 2007, San Jose, California, USA

by and

Photonics packaging, integration, and interco ...
Allen M. Earman, Ray T. Chen
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Last edited by MARC Bot
February 13, 2019 | History
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An edition of Photonics packaging, integration, and interconnects VII (2007)

Photonics packaging, integration, and interconnects VII

23-25 January, 2007, San Jose, California, USA

by and

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Publish Date
Publisher
SPIE
Language
English

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Subjects

Congresses, Photonics, Optical interconnects, Optoelectronic devices, Microelectronic packaging, Design and construction
Edition Availability
Cover of: Photonics packaging, integration, and interconnects VII
Photonics packaging, integration, and interconnects VII: 23-25 January, 2007, San Jose, California, USA
2007, SPIE
in English

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Book Details

Edition Notes

An earlier conference was called: Photonics packaging and integration VI.

Includes bibliographical references and author index.

Published in
Bellingham, Wash
Series
Proceedings of SPIE -- v. 6478, Proceedings of SPIE--the International Society for Optical Engineering -- v. 6478.
Genre
Congresses
Other Titles
Photonics packaging and integration VI.

Classifications

Dewey Decimal Class
621.36
Library of Congress
TK8300 .P478 2007, TK8300.P478 2007

The Physical Object

Pagination
1 v. (various pagings) :

Edition Identifiers

Open Library
OL23733720M
ISBN 10
0819465917
ISBN 13
9780819465917
LCCN
2007295465

Work Identifiers

Work ID
OL18803735W

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February 13, 2019 Created by MARC Bot import existing book