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1
Stress-Induced Phenomena in Metallization: Third International Workshop (AIP Conference Proceedings, No. 373)
April 15, 1996, American Institute of Physics
Hardcover
in English
- 1 edition
1563964392 9781563964398
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2
Stress-induced phenomena in metallization: third international workshop, Palo Alto, CA June 1995
1996, AIP Press
in English
1563964392 9781563964398
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Book Details
Table of Contents
Analysis of stresses in passivated metal lines / U. Burges ... [et al.]
Investigation of stresses in passivated gold lines / R. Pollak ... [et al.]
Plastic deformation and stress-induced voiding in Al-Cu interconnects / D. Jawarani ... [et al.]
Stress relaxation and microstructural change in passivated Al(Cu) lines during isothermal annealing / I.-S. Yeo ... [et al.]
Electrical measurement of stress-induced void growth / T.D. Sullivan, D.P. Bouldin, and D.H. Yao
Stress generation in Al-Si-Cu metallization resulting from thermal cycling between -196[degrees]C and 250[degrees]C / F. Baldwin ... [et al.]
Stress concentration at W vias / J.R. Lloyd, J.B. Sauber, and J.A. Walls
Modeling electromigration in multi-level interconnects / D. Chidambarrao and M.M. Pelella
Stress and alloying effects in electromigration / M.A. Korhonen ... [et al.]
Electromigration-induced voiding mechanisms in metallizations / O. Kraft, M. Bauer, and E. Arzt
Initial void formation in bamboo Al-Cu(1%) two-level structure / P.-H. Wang ... [et al.]
Comparison of electromigration in submicron Al(Cu) and Cu thin film lines / C-K. Hu ... [et al.]
Effects of aluminum texture on electromigration lifetime / H. Toyoda ... [et al.]
The effect of test structure and stress condition on electromigration failure / H. Kawasaki ... [et al.]
Cu behaviors induced by aging and their effects on electromigration resistance on Al-Cu lines / T. Nogami and T. Nemoto
In-situ side-view observation of electromigration in layered Al lines by ultrahigh voltage transmission electron microscopy / H. Okabayashi ... [et al.]
Line length effects on lifetime measurements and resistance saturation during electromigration testing / R.G. Filippi, G.A. Biery, and R.A. Wachnik
Dependence of electromigration failure modes on EM-induced and thermally-induced mechanical stress in interconnect lines / S. Pramanick ... [et al.]
Resistance oscillations induced by DC electromigration / S. Shingubara ... [et al.]
Void, Si nodule and current observations by optical beam heating and current change measurement / K. Nikawa and S. Inoue
Interface diffusion and electromigration failure in narrow aluminum lines with barrier layers / R.A. Augur, F. Van den Elshout, and R.A.M. Wolters
Highly electromigration-resistive via structure using Al-reflow for multi-level interconnection / I.S. Park.
Edition Notes
"DOE CONF-9506336"--T.p. verso.
Includes bibliographical references and index.
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