Electrical modeling and design for 3D integration

3D integrated circuits and packaging signal integrity, power integrity, and EMC

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December 21, 2021 | History

Electrical modeling and design for 3D integration

3D integrated circuits and packaging signal integrity, power integrity, and EMC

"The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a number of special methods to solve the SI, PI, and EMI problems and provides an overview of the existing electromagnetic modeling methods used in electronic chips, package, and PCB. The text also addresses the limitations individuals in the real-world engineering community face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants"--

"The book attempts to systematically present a series of fast efficient electromagnetic modeling techniques to readers involved in the design and analysis of the large and complex electronic structures. The book will present a number of special methods to solve the SI, PI, and EMI problems. The book will provide an overview of the existing electromagnetic modeling methods used in electronic chips, package and PCB, and address the limitations individuals in the real-world engineering community face"--

Publish Date
Publisher
Wiley-IEEE Press
Language
English

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Previews available in: English

Book Details


Edition Notes

Published in
Hoboken, N.J

Classifications

Dewey Decimal Class
621.3815
Library of Congress
TK7874.893 .L53 2011, TK7874.893 .L53 2012, TK7872.M25

The Physical Object

Pagination
p. cm.

Edition Identifiers

Open Library
OL25004738M
ISBN 13
9780470623466
LCCN
2011028946

Work Identifiers

Work ID
OL16117031W

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