An edition of Adhesive Materials for Electronic Applications (2005)

Adhesive Materials for Electronic Applications

Polymers, Bonding, and Reliability

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Cover of: Adhesive Materials for Electronic Applications by Dale W. Swanson, Dale W Swanson
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Last edited by ImportBot
February 25, 2022 | History
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An edition of Adhesive Materials for Electronic Applications (2005)

Adhesive Materials for Electronic Applications

Polymers, Bonding, and Reliability

by and

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Publisher
William Andrew Publishing
Language
English
Pages
485

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Subjects
Electronic packaging, Adhesives, Polymers, Electronic apparatus and appliances, reliability

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Edition Availability
Cover of: Adhesive Materials for Electronic Applications
Adhesive Materials for Electronic Applications: Polymers, Bonding, and Reliability
March 2005, William Andrew Publishing
Hardcover in English
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Book Details

Classifications

Library of Congress
TK7870.S895 2003

The Physical Object

Format
Hardcover
Number of pages
485

ID Numbers

Open Library
OL11358417M
ISBN 10
081551493X
ISBN 13
9780815514930
OCLC/WorldCat
51477858
Goodreads
5696074

Source records

Better World Books record

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
February 25, 2022 Edited by ImportBot import existing book
April 29, 2011 Edited by OCLC Bot Added OCLC numbers.
April 24, 2010 Edited by Open Library Bot Fixed duplicate goodreads IDs.
April 16, 2010 Edited by bgimpertBot Added goodreads ID.
April 30, 2008 Created by an anonymous user Imported from amazon.com record