MARC Record from Library of Congress

LEADER: 01873cam a22003017a 4500
001 2005295019
003 DLC
005 20060330182345.0
008 050126s2004 ohua b 001 0 eng d
010 $a 2005295019
040 $aPGM$cPGM$dDLC
020 $a0871708043
035 $a(OCoLC)ocm57017140
042 $alccopycat
050 00 $aTK7871$b.M52 2004
245 00 $aMicroelectronics failure analysis :$bdesk reference /$cedited by The Electronic Device Failure Analysis Society, Desk Reference Committee.
250 $a5th ed.
260 $aMaterials Park, Ohio :$bASM International,$cc2004.
300 $axiv, 800 p. :$bill. ;$c28 cm. +$e1 CD-ROM (4 3/4 in.).
500 $aIncludes bibliographical references and index.
505 0 $aIntroduction -- Failure analysis process flow -- Failure verification -- Failure mode: failure classifications -- Special devices -- Non-destructive analysis techniques -- Depackaging -- Photon emission (electroluminescence) localization techniques -- Microthermography -- Laser and particle beam-based localization techniques -- Deprocessing -- General imaging techniques -- Local deprocessing and imaging -- Materials analysis techniques -- Important topics for semiconductor devices -- FA techniques/tools roadmaps -- FA operation and management -- Appendix.
538 $aSystem requirements for accompanying CD-ROM: Windows 95/98/NT/ME/2000/XP ; Macintosh 8/9/Classic.
650 0 $aElectronics$xMaterials$xTesting$xHandbooks, manuals, etc.
650 0 $aMicroelectronics$xMaterials$xTesting$vHandbooks, manuals, etc.
650 0 $aMicroelectronics$xMaterials$xDefects$vHandbooks, manuals, etc.
650 0 $aElectronic apparatus and appliances$xTesting$vHandbooks, manuals, etc.
650 0 $aSemiconductors$xDefects$vHandbooks, manuals, etc.
710 2 $aElectronic Device Failure Analysis Society$bDesk Reference Committee.