| Record ID | harvard_bibliographic_metadata/ab.bib.11.20150123.full.mrc:619216804:1007 |
| Source | harvard_bibliographic_metadata |
| Download Link | /show-records/harvard_bibliographic_metadata/ab.bib.11.20150123.full.mrc:619216804:1007?format=raw |
LEADER: 01007nam a2200277Ia 45 0
001 011693535-9
005 20121031130943.0
008 971024s1995 sw a b 000 0 eng d
020 $a9155436331
020 $a9789155436339
035 $a(Crl)b22893805
035 0 $aocm37835537
040 $aNDD$cNDD$dCRL$dMH
100 1 $aLjungberg, Karin.
245 10 $aPhenomenology of silicon wafer bonding /$cKarin Ljungberg.
260 $aUppsala :$bActa Universitatis Upsaliensis,$c1995.
300 $a59 p. :$bill. ;$c25 cm.
490 0 $aActa Universitatis Upsaliensis.$pComprehensive summaries of Uppsala dissertations from the faculty of science and technology,$x1104-232X ;$v166.
502 $aThesis (doctoral)--Universitas Upsaliensis, 1995.
504 $aIncludes bibliographical references (p. 53-59)
650 0 $aSilicon-on-insulator technology.
650 0 $aSemiconductor wafers$xDesign and construction.
650 0 $aSilicon.
710 2 $aUppsala universitet.
988 $a20081028
906 $0OCLC