Item Details cdming@gmail.com Ver/Language
IPC-A-610J ★★ Acceptability of Electronic Assemblies J "English
Chinese
Japanese"
IPC-A-610H-C Telecom Addendum to IPC-A-610 Revision H Acceptability of Electronic Assemblies HC ENGLISH
IPC-A-610H-A IPC-J-STD-001HA/A-610HA: Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies HA "English
Chinese"
IPC-A-600M ★★ Acceptability of Printed Boards "M
K" "English
Chinese"
IPC/WHMA-A-620E★★ Requirements and Acceptance for Cable and Wire Harness Assemblies "E
D" "English
Chinese
French
(Français)"
IPC/WHMA-A-621E-S Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620D "Es
Ds" "English
Chinese"
IPC-7711/21D ★★ Rework, Modification and Repair of Electronic Assemblies D "English
Chinese"
IPC J-STD-001J ★★ Requirements for Soldered Electrical and Electronic Assemblies J "English
Chinese"
IPC J-STD-001Ga A-610Ga IPC-J-STD-001GA/A-610GA: Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies GA "English
Chinese"
IPC J-STD-001Ha A-611Ha IPC-J-STD-001HA/A-610HA: Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-611H Acceptability of Electronic Assemblies HA English
IPC J-STD-001Hs Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies Hs English
IPC J-STD-002E ★ Solder Ability Tests for Component Leads,Terminations,Lugs,Terminals and Wires E "English
Chinese
Japanese日本語"
IPC J-STD-003D ★ Solder Ability Tests for Printed Boards D 2022 "English
Chinese"
IPC J-STD-004D ★ Requirements for Soldering Fluxes D "English
Chinese"
IPC J-STD-005B ★ Requirements for Soldering Pastes "B
A" "English
Chinese"
IPC J-STD-006C  Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications C  "English
Chinese"
IPC J-STD-020F  Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices F 2022 "English
Chinese"
IPC J-STD-030 JOINT INDUSTRY STANDARD Selection and Application of Board Level Underfill Materials A English
IPC J-STD-033D Handling,Packing,Shipping and Use of Moisture/Reflow  Sensitive Surface Mount Devices  D "English
Chinese"
IPC J-STD-035A Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components A 2022 English
IPC J-STD-075  Classification of Non-IC Electronic Components for Assembly Processes  A 2018 English
IPC J-STD-609C Marking,Symbols,and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly "C
A" "English
Chinese"
IPC-0040  Optoelectronics Assembly and Packaging Technology 2003 ENGLISH
IPC-1065 Material Declaration Handbook 2005 English
IPC-1066 Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices 2004 ENGLISH
"IPC-1072
(Supersed by IPC-1791)" Intellectual Property Protection in Electronic Assembly Manufacturing 2017 English
IPC-1401 Material Declaration Handbook (for Users and Manufacturers of Printed Circuit Boards) A2021 "English
Chinese"
IPC-1402 Standard for Greener Cleaners Used in Electronic Manufacturing 2022 English
IPC-1601  Printed Board Handling and Storage Guidelines A "English
Chinese"
IPC-1602A Standard for Printed Board Handling and Storage "A2024
2020" "English
Chinese"
IPC-1710 OEM Standard for Printed Board Manufacturers Qualification Profile A English
IPC-1720A  Assembly Qualification Profile A "English
Chinese"
IPC-1730A Laminator Qualification Profile A English
IPC-1751 Generic Requirements for Declaration Process Managment A English
IPC-1752 Materials Declareation Mangaement B English
IPC-1753 Laboratory Report Standard 2013 English
IPC-1574 Materials And Substances Declaration For Aerospace And Defense And Other Industrie 2020AM2 English
IPC-1755 Conflict Minerals Data Exchange Standard A2020 English
IPC-1756 Manufacturing Process Data Mangement  2010 English
IPC-1758 Declaration Requirements for Shipping,Pack and Packing Materials 2012 English
IPC-1771 Automotive supplier checklist 2024 English
IPC-1782B Standard for Manufacturing and Supply Chain Traceability of Electronic Products B English
IPC-1791D Trusted Electronic Designer,Fabricator and Assembler Requirements D 2023 English
IPC-1792 Standard for the Management and Mitigation of Cybersecurity Incidents in the Manufacturing Industry Supply Chain 2022 English
IPC-2141 Design Guide for High-Speed Controlled Impedance Circuit Boards A English
IPC-2152 Standard for Determining Current Carrying Capacity in Printed Board Design 2009 "English
German"
IPC-2221C  Generic Standard on Printed  Board Design "C
A" "English
Chinese"
IPC-2222B  Sectional Design Standard for Rigid Organic Printed Boards B "English
Chinese"
IPC-2223E  Sectional Design Standard for Flexible Printed Boards E "English
Chinese"
IPC-2224 Sectional Standard for Design of PWBs for PC Cards 98 English
IPC-2225 Sectional Desingn Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 98 English
IPC-2226 Sectional Desing Standard for High Densityh Interconnect (HDI) Printed Boards A English
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards 2022 English
IPC-2231 DFX Guidelines 2019 "English
Chinese"
IPC-2251 Design Guide for the Packaging of High Speed Electronic Circuits 2003 English
IPC-2252 Design Guide for RF/Microwave Circuit Boards 2002 "English
Chinese"
IPC-2291 Design Guideline for Printed Electronics 2013 English
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates A2022 English
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates 2024 English
IPC-2315 Design Guide for High Density Interconnects (HDI) and Microvias 2000 "English
Chinese"
IPC-2316 Design Guide for Embedded Passive Device Printed Boards 2007 English
IPC-2501 Definition for Web-Based Exchange of XML Data (Message Broker) 2003 English
IPC-2511 Generic Requirements for Implementation of  Product Manufacturing Description Data and Transfer XML Schema Methodology. B English
IPC-2513 Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description [DRAWG] A English
IPC-2514 Sectional Requirements for Implementation of Printed Board Fabrication Data Description [BDFAB] A English
IPC-2515 Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description[DBTST] A English
IPC-2516 Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description [BDASM] A English
IPC-2517 Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description[ASEMT] A English
IPC-2518 Sectional Requirements for Implementation of Part List Product Data Description[PTLST] A English
IPC-2531 SMEMA Standard Recipe File Format Specification 1999 English
IPC-2541 Generic Requirements for Electronics Manufacturing Shop-Floor Equipment Communication Messages(CAMX) 2001 English
IPC-2546 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly am2(2005) English
IPC-2547 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Rework 2002 English
IPC-2551 Manufacturing Execution System Communications 2002 English
IPC-2552 General Electronic Components Model Based Definition(MBD) Standard 2022 English
IPC-2571 Generic Requirements for Electronics Manufacturing Supply Chain Communication-Product Data eXchange (PDX) 2001 English
IPC_2576 Sectional Requirements for Electronic Manufacturing supply Chain Communication of As-Built Product Data-Product Data Xchange(PDX) 2001 English
IPC-2577 Sectional Requirements for Supply chain Communication of Manufacturing Quality Assessment-Product Data eXchange (PDX) 2001 English
IPC-2578 Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data - Product Data eXchange (PDX) 2001 English
IPC-2581 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology C English
IPC-2582 Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description 2007 English
IPC-2583 Sectional Requirements for Implementation of design Characteristics for Manufacturing Data Description 2007 English
IPC-2584 Sectional Requirements for Implementation of Printed Board Fabrication Data Descriptio 2007 English
IPC-2588 Sectional Requirements for Implementation of Part List Product Data Description 2007 English
IPC-2591 Connected Factory Exchange (CFX) V1.7 "2023(1.7)
2019" "English
Chinese"
IPC-2611 Generic Requirements for Electronic Product Documentation 2010 English
IPC-2612 Sectional Requirements for Electronic Diagramming Documentation (Schenmatic and Logic Descriptions) 2010 English
IPC-2612-1 Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2010 English
IPC-2614 Requirements for Board Fabrication Documentation 2010 English
IPC-2615 Printed Board Dimensions and Tolerances 2010 English
IPC-2901 Pb-free Design & Assembly Implementation Guide 2018 English
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives 1996 English
IPC-3408 General Requirements for Anisotropically Conductive Adhesive Films 1996 English
IPC-4101E Specification for Base  Materials for Rigid and  Multilayer Printed Boards  E+WAM1 "English
Chinese"
IPC-4103 SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS B English
IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials 1999 English
IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards 1998 English
IPC-4121 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Application 2000 English
IPC-4130 Specification and Characterization Methods for NonwovenE_ Glass Mat 1998 English
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Boards "B
C" "Chinese
English"
IPC-4203B COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY B English
IPC-4204B Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry "B
A" "English
Chinese"
IPC-4411 Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement A2003 English
IPC-4412C Specification for Finished Fabric Woven from "E"  Glass for Printed Boards  C English
IPC-4413 Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards 2023 English
IPC-4552 Specifiaction for Electroless Nickel/Immersion Gold (ENIG)Plating for Printed Circuit Boards B "English
Chinese"
IPC-4553 Specification for Immersion Silver Plating for Printed Boards  A "English
Chinese"
IPC-4554  Specification for Immersion Tin Plating for Printed  Circuit Boards  2012 "English
Chinese"
IPC-4555 Performance Specification for high Temperature Organic Solderability Preservatives (OSP) for Printed Boards 2022 English
IPC-4556 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards 2016 "English
Chinese"
IPC-4562B  Metal Foil for Printed Board  Applications  "B 2023
A 2000" "English
Chinese,"
IPC-4563 Resin Coated Copper Foil for Printed Boards Guideline 2007 English
IPC-4591 Requirements for Printed Electronics Functional Conductive Materials A 2018 English
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials 2022 English
IPC-4761 Design Guide for Protectionof Printed Board Via Structures 2006 English
IPC-4781 Qualification and Performance Specification of Permanent,Semi-Permanent and Temporary Legend and/or Marking Inks 2008 English
IPC-4811 Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards 2009 English
IPC-4821 Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards 2010 English
IPC-4921A Requirements for Printed Electronics Base Materials A "English
Chinese"
IPC-4922 Requirements for Sintering Materials for Electrical and Thermal Interconnects 2024 English
IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications 2022 English
IPC-5701 Users Guide for Cleanliness of Unpopulated Printed Boards 2003 English
IPC-5702 Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards 2007 English
IPC-5703 CLEANLINESS GUIDELINES FOR PRINTED BOARD FABRICATORS 2013 English
IPC-5704 Cleanliness Requirements for Unpopulated Printed Boards 2009 English
IPC-6011A  Generic Performance Specification for Printed Boards "A 2025
1996" "English
中文"
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards F "English
Chinese"
IPC-6012EA Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards E-a "English
Chinese"
IPC-6012FS Space and Military Avionics Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards FS "English
Chinese"
IPC-6012EM Medical Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards EM "English
Chinese"
IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards E "English
Chinese"
IPC-6015 Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures 98 English
IPC-6016 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards 1999 English
IPC-6017A Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices A English
IPC-6018D Qualification and Performance Specification for High Frequency (Microwave) Printed Boards "D
C" "English
Chinese"
IPC-6018D-S Space and Military Avionics Applications Addendum to IPC-6018D Qualification and Performance Specification for C100High Frequency (Microwave) Printed Boards Ds English
IPC/JPCA-6801 Terms and definitions,Test Methods,and Design Examples for Build-Up/High Density Interconnedt (HDI) Printed Wiring Boards 2000 English
IPC-6901 Application Categories for Printed Electronics 2015 English
IPC-6902 Qualification And Performance Specification For Printed Electronics On Flexible Substrates 2021 English
IPC-6903 Terms and Definitions for the Design and Manufacture of Printed Electronics 2018 English
IPC-6904 Qualification and Performance Specification for Printed Electronics on Rigid Substrates 2024 English
IPC-7091A Design and Assembly Process Implementation of 3D Components A 2023 English
IPC-7092A  Design and Assembly Process Implementation for Embedded components "A2022
2015" "English
Chinese"
IPC-7093A Design and Assembly Process Implementation for Bottom Termination Components A "English
Chinese"
IPC-7094A Design and Assembly Process Implementation for Flip Chip and Die Size Components A English
IPC-7095E Design and Assembly Process Implementation for BGAs E "English
Chinese"
IPC-7251 IPC 7251-2008 Generic Requirements for Through-Hole Design and Land Pattern Standard 2008 English
IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard B "English
Chinese"
IPC-7352 Generic Guideline for Land Pattern Design 2023 English
IPC-7525C  Stencil Design Guidelines C "English
Chinese"
IPC-7526A Stencil and Misprinted Board Cleaning Handbook A 2022 English
IPC-7527 Requirements for Solder Paste Printing 2012 "English
Chinese"
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave) "B
A" "English
Chinese"
IPC-7535 Requirements for Solder Dross Reduction Chemicals  2016 "English
Chinese"
IPC-7621 Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics 2018 English
IPC-7801 Reflow Oven Process Control Standard "A
2015" "English
Chinese"
IPC-7901 Design and Assembly Process Implementation of 30 Components 2017 English
IPC-7912 Caluculation of DPMO and Manufacturing Indices for Printed Board Assemblies A ENGLISH
IPC-8401 Guidelines for In-Mold Electronics 2024 ENGLISH
IPC-8479-1 Cleaning Methods and Contamination Assessment for Optical Assembly 2005 ENGLISH
IPC-8701 Final Acceptance Criteria Standard for PV Modules-Final Module Assembly 2014 ENGLISH
IPC-8911 Requirements for Conductive Yarns for E-Textiles Applications 2025 ENGLISH
IPC-8921 Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires 2019 ENGLISH
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles 2022 ENGLISH
IPC-8971 Requirements for Electrical Testing of Printed Electronics E-Textiles 2022 ENGLISH
IPC-9111 Troubleshooting for Printed Board Assembly Processes 2019 "English
Chinese"
IPC-9121 TROUBLESHOOTING FOR PBC FABRICATION PROCESSES "A 2022
2016" "English
Chinese"
IPC-9151 Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard and Database D English
ipc-9191 General Gui delines for Impl ementation of Statistical Process Control (SPC) 1999 English
IPC-9194 Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline 2004 English
IPC-9199 StatisticalProcess Control (SPC) Quality Rating 2002 English
IPC-9201 Surface Insulation Resistance Handbook 1996 English
IPC-9202 Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance 2011 English
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle A2022 English
IPC-9204 Guideline on Flexibility and Stretchability Testing for Printed Electronics 2017 English
IPC-9241 Guidelines for Microsection Preparation 2016 English
IPC-9252B Surface Insulation Resistance Handbook "B
A" "English
Chinese"
IPC-9253
IPC-9254
IPC-9255
IPC-9256
IPC-9257 Requirements for Electrical Testing of Flexible Printed Electronics 2021 English
IPC-9261  In-Process DPMO and Estimated Yield for PCAs A English
IPC-9262 Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment 2016 Chinese
IPC-9301 Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability 2018 English
IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components (Preconditioning IC omponents) 1995 English
IPC-9502 PWB assembly soldering process guideline for electronic components 1999 English
IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components 1998 English
IPC-9505 Guideline Methodology for Assessing Component and Cleaning Materials Compatibility 2017 English
IPC-9591 Performance Parameters (Mechanical, Electrical,Environmental and Quality/Reliability) for Air Moving Devices 2006 English
IPC-9592 Requirements for Power Conversion Devices for the Computer and Telecommunications Industries B English
IPC-9631 Users Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation 2010
IPC-9641 High Temperature Printed Board Flatness Guideline 2013 English
IPC-9691B  User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)  B "English
Chinese"
IPC-9701B Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments "B 2022
A" "English
Chinese"
IPC-9702  Monotonic Bend Characterization of Board-Level Interconnects  2004 "English
Chinese"
IPC-9703 Mechanical Shock Test Guidelines for Solder Joint Reliability 2009 "English
Chinese"
IPC-9704A  Printed Circuit Assembly Strain Gage Test Guideline A "English
Chinese"
IPC-9706 Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection 2013 English
IPC-9707 Spherical Bend Test Method for Characterization of Board Level Interconnects ＋AM1 English
IPC-9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Testing 2013 English
IPC-9708  Test Methods for Characterization of Printed Board Assembly Pad Cratering  2010 "English
Chinese"
IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing A 2021 English
IPC-9716 Requirements for automated Optical Inspection (AOI) Process Control for Printed board Assemblies 2024 English
IPC-9797 Press-Fit Standard for Automotive Requirements and Other High-Reliability Applications "A2023
2020" "English
Chinese"
IPC-9850 Surface Mount Equipment Characterization 2001 English
IPC-9851 Mechanical Equipment Interface Standard 2007 English
IPC-9852 The Global Standard for Machine-to-MachineCommunication in SMT Assembly 2024(1.6) English
IPC-A-311 Process Controls for Phototool Generation and Use 1996 English
IPC-A-630★★ Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures 2013 "English
Chinese"
IPC-A-640A Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies 2022 "English
Chinese"
IPC-AJ-820A Assembly and Joining Handbook A "English
Chinese"
IPC-CA-821 General Requirements for Thermally Conductive Adhesives 1995 English
IPC-CC-110A Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Application A English
IPC-CC-830C  Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies C "English
Chinese
Japanese日本語"
IPC-CF-152 Composite Metallic Material Specification for Printed Wiring Boards B English
IPC-CH-65B  Guidelines for Cleaning of Printed Boards and Assemblies B "English
Chinese"
IPC-D-279 Design Guide for Reliable Surface Mount Technology Printed Board Assemblies 1996 English
IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes English
IPC-D-325A Documentation Requirements for Printed Boards, Assemblies and Support Drawings 1995 English
IPC-D-356 Bare Substrate Electrical Test Data Format B English
IPC-D-422 Design Guide for Press Fit Rigid Printed Board Backplanes 1982 English
IPC-D-620A Design and Critical Process Requirements for Cable and Wiring Harnesses A English
IPC-DR-572A Drilling Guidelines for Printed Boards A English
IPC-DRM-18J Component Identification Training and Reference Guide J English
IPC-DRM-53 Introduction to Electronics Assembly Training & Reference Guide English
IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual 2002 English
IPC-DRM-PTH-G Through-Hole Solder Joint Evaluation Training & Reference Guide G English
IPC-DRM-SMT-G Surface Mount Solder Joint Evaluation Training & Reference Guide G English
IPC-DRM-WHA-C Wire Harness Assembly Training & Reference Guide C English
IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Board
IPC-FA-251 Assembly Guidelines for Single-Sided and Double-Sided Flexible Printed Circuits 1992 E
IPC-FC-234A Pressure Sensitive Adhesive (PSA)Assembly Guidelines for Flexible,Rigid or Rigid-Flex Printed Boards 2014 English
IPC-HDBK-001★ Handbook and Guide to Supplement J-STD-001 H English
IPC-HDBK-005 Guide to Solder Paste Assessment 2006 "English
Chinese"
IPC-HDBK-610 Handbook and Guide to IPC-A-610  2005 English
IPC-HDBK-620 Handbook and Guide to IPC-D-620 and IPC/WHMA-A-620 2018 "English
Chinese"
IPC-HDBK-630 Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures 2014 English
IPC-HDBK-830 Guidelines for Design, Selection and Application of Conformal Coatings A English
IPC-HDBK-840 Solder Mask Handbook 2006 English
IPC-HDBK-850 Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly 2012 English
IPC-HDBK-4691 Handbook on Adhesive Bonding in Electronic Assembly Operations 2015 English
IPC-HDBK-9798 Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications 2022 English
IPC-MI-660 Guidelines for Incoming inspection of Printed board Materials English
IPC-MICRO ExposurePhenomena in Cross Section of Plated Through HolesOriginally English
IPC-MS-810 Guidelines for High Volume Microsection 1993 English
IPC-OI-645 Standard for Visual Optical Inspection Aids 1993 English
IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly A English
IPC-PTH2 Minimum Through Hole Solder Joint Requirements • Class 2 English
IPC-PTH3 Minimum Through Hole Solder Joint Requirements • Class 3 English
IPC-QE-605A  PCB Quality Evaluation Handbook A English
IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 1992 English
IPC-QL-653A Certification of Facilities That Inspect_Test Printed Boards,Components and Materia A English
IPC-S-816 SMT Process Guideline and Checklist 1993 English
IPC-SG-141 Specification for Finished Fabric Woven From ‘‘S’’ Glass for Printed Boards 1992 English
IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Suerface Mounting 1998 English
IPC-SM-782A Surface Mount Design and Land Pattern Standard A English
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation 1990 English
IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount solder Attachments 1992 "English
Chinese"
IPC-SM-786 Procedeures for Characterizing and Handling of Moisture/Reflow Sensitve ICs A
IPC-SM-817A  General Requirements for Dielectric Surface Mount Adhesives A "English
Chinese"
IPC-SM-840E  Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials "E
E" "English
Chinese"
IPC-SPVC-WP-006 Round Robin Testing and Analysis Lead-Freee Alloys 2003 English
IPC-T-50 N Terms and Definitions for Interconnecting and Packaging Electronic Circuits  N English
IPC-T-51  Terms and Definitions for the Design and Manufacture of Printed Electronics 2022 English
IPC-TM-650★ TEST METHODS MANUAL 2024 "English
Chinese"
IPC-TP-1114 Laymans' Guide to Qualifying a Process to J-STD-001 1998 English
IPC-TR-461 SOLDERABILITY EVALUATION OF THK & THN FUSED CTNGS 1979 English
IPC-TR-464 Accelerated Aging for Solderability Evaluations 1984 English
IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results 1993 English
IPC-TR-476 Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies A English
IPC-TR-483 Dimensional Stability Testing of Thin Laminates 1991 English
IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated-Through Holes in Printed Wiring Boards 1988 English
IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing 2002 English
IPC-TR-585 Time, Temperature and Humidity Stress of Final Board Finish Solderability 2006 English
IPC-TR-586 Immersion Silver Plating C180 Thickness Round Robin Investigation Data Set Compendium 2009 English
IPC-TR-587 Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report 2020 English
IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual 2002 English
IPC-WP-009 A Summary of Tin Whisker Research References 2009 English
IPC-WP-011 Guidance for Strain Gage Limits for Printed Circuit Assemblies 2011 English
IPC-WP-012 Pb-free Electronics Risk Management (PERM) Council Pb-free Research Priorities 2014 English
IPC-WP-013 Analytical Procedures for Portable Lead-Free Alloy Test Data 2014 English
IPC-WP-014A Pb-free Electronics Risk Management (PERM) Council Position on the Use of Pb-free Electronics in the Aerospace, Defense and High Performance Electronics Industries A2020 English
IPC-WP-015 Pb-free Electronics Risk Management (PERM) Council Re-Baseline of the Lead-Free Manhattan Project 2016 English
IPC-WP-019 An Overview on Global Change in Ionic Cleanliness Requirements B English
IPC-WP-021 Considerations of New Classes of Coatings for IPC-CC-830 Revision C 2019 English
IPC-WP-023 IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test:The Hidden Reliability Threat —Weak Microvia Interface 2018 English
IPC-WP-024 IPC White Paper on Reliability and Washability of Smart Textile Structures-Readiness for the Market 2018 "English
Chinese"
IPC-WP-025 Ipc White Paper On A Framework For The Engineering And Design Of E-Textiles 2019 English
IPC-WP-026 IPC Technology Solutions White Paper on Blockchain and the Electronics Industry: A review of the Current State of Blockchain Technology and Its Potential Applications in Electronics Manufacturing 2019 English
IPC-WP-028 Guidance on Objective Evidence for Validating the Acceptability of Bubbles in Conformal Coatings 2024 English
IPC-WP-113 Guidance for the Development and Implementation of a red Plague Control Plan (RPCP) 2015 English
IPC-WP-114 Guidance for the Development and Implementation of a White Plague Control Plan (WPCP) 2016 English
ipcstd@outlook.com If you need other Standard files ,Please let me know: cdming@gmail.com

IPC-A-610J_EN 2024 TOC Acceptability of Electronic Assemblies

IPCSTD@OUTLOOK.COM

VITA STANDARDS LIST

IPCSTD@OUTLOOK.COM

Designation Title

VMEbus Handbook, 4th Edition
ANSI/VITA 1-1994 (S2021) VME64
ANSI/VITA 1.1-1997 (S2021) VME64 Extensions
ANSI/VITA 1.3-1997 (S2021) VME64x 9U x 400mm Format
ANSI/VITA 1.5-2003 (S2014) VME 2eSST
ANSI/VITA 1.6-2000 (S2021) Keying for Conduction Cooled VME64x
ANSI/VITA 1.7-2003 (S2014) Increased Current Level for 96 Pin &160 Pin DIN/IEC Connector
VITA 3-1995 (S2022) Board Level Live Insertion for VMEbus
VITA 4-1995 (S2022) IP Modules
VITA 4.1-1996 (S2022) IP I/O Mapping to VME64x
VITA 5.1-1999 (S2022) RACEway Interlink on VME
VITA 6-1994 (S2022) Signal Computing System Architecture (SCSA) on VME
VITA 6.1-1996 (S2022) Extensions to ANSI/VITA 6-1994 Signal Computing System Architecture
VITA 10-1995 (W2012) SkyChannel Packet on VME P2
VITA 12-1997 (S2022) M-Module
VITA 13-1995 (W2006) VMEbus Pin Assignment Standard for ISO/IEC 14575 (IEEE Std. 1355-1995 (H.I.C.))
VITA 17-1998 (S2022) Front Panel Data Port (FPDP)
ANSI/VITA 17.1-2015 (R2022) Serial Front Panel Data Port
ANSI/VITA 17.3-2018 Serial Front Panel Data Port (sFPDP) Gen 3.0 Serial Front Panel Data Port (sFPDP) Gen 3.0
VITA 19.1-1998 (W2006) BusNet Media Access Control (MAC) Standard
VITA 19.2-1998 (W2006) BusNet Link Layer Control (LLC) Standard
ANSI/VITA 20-2005 (S2018) Conduction Cooled PMC
VITA 23-1998 (S2022) VME64 Extensions for Physics and Other Applications
VITA 25-1998 (W2006) VISION (Versatile I/O Software Interface for Open-bus Networks)
VITA 26-1998 (S2022) Myrinet-on-VME Protocol Standard
VITA 29-2001 (W2006) PC*MIP
VITA 30-2000 (S2022) 2mm Equipment Practice for Eurocard Systems
VITA 30.1-2008 (S2022) 2mm Connector Practice on Conduction Cooled Euroboards
VITA 30.2-2001 (IEC) Power Connector Equipment Practice
VITA 31.1-2003 (S2022) Gigabit Ethernet on VME64x Backplanes
ANSI/VITA 32-2003 (S2014) Processor PMC
ANSI/VITA 35-2000 (S2021) PMC-P4 Pin Out Mapping to VME-P0 and VME64x-P2
VITA 38-2003 (S2022) System Management on VME
VITA 39-2003 (S2022) PCI-X for PMC and Processor PMC
ANSI/VITA 40-2020 Service and Status Indicator Standard Service and Status Indicator Standard
VITA 41.0-2006 (S2022) VXS VMEbus Switched Serial Standard
VITA 41.1-2006 (S2022) VXS 4X InfiniBand ™Protocol Layer Standard
VITA 41.2-2006 (S2022) VXS 4X Serial RapidIO Protocol Layer Standard
VITA 41.6-2009 (S2022) VXS 1X Gigabit Ethernet Control Channel Layer Standard
ANSI/VITA 42.0-2021 XMC: Switched Mezzanine Card (XMC) Auxiliary Standard
VITA 42.1-2006 (S2022) XMC Parallel RapidIO 8/16 LP-LVDS Protocol Layer Standard
ANSI/VITA 42.2-2006 (S2018) XMC Serial RapidIO Protocol Layer Standard
ANSI/VITA 42.3-2020 XMC PCI Express Protocol Layer Standard
ANSI/VITA 42.6-2009 (S2024) XMC 10 Gigabit Ethernet 4-Lane Protocol Layer Standard
ANSI/VITA 46.0-2023 +Errata VPX Baseline Standard
ANSI/VITA 46.1-2007 (S2018) VMEbus Signal Mapping on VPX
ANSI/VITA 46.3-2012 (S2024) Serial RapidIO on VPX Fabric Connector
ANSI/VITA 46.4-2012 (S2025) PCI Express ®on the VPX Fabric Connector
ANSI/VITA 46.6-2013 (S2025) Gigabit Ethernet Control Plane on VPX
ANSI/VITA 46.7-2012 (S2024) Ethernet on VPX Fabric Connector
ANSI/VITA 46.9-2018 (R2024) PMC/XMC Rear I/O Fabric Signal Mapping on 3U and 6U VPX Modules Standard
ANSI/VITA 46.10-2009 (S2024) Rear Transition Module for VPX
ANSI/VITA 46.11-2022 System Management on VPX
ANSI/VITA 46.30-2020 Higher Data Rate VPX
ANSI/VITA 46.31-2025 Higher Data Rate VPX - Solder Tail in Blind via
VITA 47 Bundle VITA 47 Standards Package Construction, Safety, and Quality for Plug-In Modules Standard
ANSI/VITA 47.0-2019 Construction, Safety, and Quality for Plug-In Modules Standard
ANSI/VITA 47.1-2025 Common Requirements for Environments, Design and Construction, Safety, and Quality Standard
ANSI/VITA 47.2-2019 Class 2 Requirements for Environments, Design and Construction, Safety, and Quality Standard
ANSI/VITA 47.3-2019 Class 3 Requirements for Environments, Design and Construction, Safety, and Quality Standard
ANSI/VITA 48.0-2022 Mechanical Standard for Microcomputers using Ruggedized Enhanced Design Implementation (REDI)
ANSI/VITA 48.1-2020 "Mechanical Standard for VPX REDI Air Cooling"
ANSI/VITA 48.2-2022 "Mechanical Standard for VPX REDI Conduction Cooling"
ANSI/VITA 48.4-2022 "Mechanical Standard for VPX REDI Liquid Flow Through Cooling"
ANSI/VITA 48.5-2010 (R2017) "Mechanical Standard for VPX REDI Air Flow Through Cooling, 1.52 ""Pitch"
ANSI/VITA 48.7-2023 "Mechanical Standard for VPX REDI Air Flow-By ™Cooling"
ANSI/VITA 48.8-2022 "Mechanical Standard for VPX REDI Air Flow Through Cooling, 1.0 ""to 1.5 ""Pitches"
ANSI/VITA 49.0-2015 (R2021) VITA Radio Transport (VRT) Standard
ANSI/VITA 49.1-2015 (R2021) VITA Radio Link Layer (VRL) Standard
ANSI/VITA 49.2-2017 (R2024) "VITA Radio Transport (VRT) Standard for Electromagnetic Spectrum: Signals and Applications"
ANSI/VITA 49A-2015 (R2021) Spectrum Survey Interoperability Standard
ANSI/VITA 51.0-2012 (S2024) Reliability Prediction
ANSI/VITA 51.1-2013 (S2025) Reliability Prediction MIL-HDBK-217 Subsidiary
ANSI/VITA 51.2-2016 (R2025) Physics of Failure Reliability Predictions
ANSI/VITA 51.3-2010 (S2024) Qualification and Environmental Stress Screening in Support of Reliability Predictions
IEEE Std 2818-2024/VITA 51.4-2024 Reliability Component Stress Analysis and Derating
VITA 53.0-2010 (S2022) Standard for Commercial Technology Market Surveillance
VITA 57 Bundle VITA 57 FMC and FMC+ Bundle
ANSI/VITA 57.1-2019 + Errata FPGA Mezzanine Card (FMC) Standard
ANSI/VITA 57.4-2018 + Errata FPGA Mezzanine Card Plus (FMC+) Standard
VITA 58.0-2009 (S2022) Line Replaceable Integrated Electronics Chassis Standard
VITA 58.1-2013 (S2022) Line Replaceable Integrated Electronics Chassis Standard, Liquid Cooled Chassis
ANSI/VITA 60-2012 (R2018) Alternative Connector for VPX
ANSI/VITA 61.0-2022 XMC 2.0
ANSI/VITA 62.0-2022 Modular Power Supply Standard
ANSI/VITA 62.1-2023 Three Phase High-Voltage Power Supply Front-End in a 3U Plug-In Module Standard
ANSI/VITA 62.2-2020 Modular Power Supply Standard for 270v Applications
ANSI/VITA 63.0-2015 (R2022) Hyperboloid Alternative Connector for VPX VITA 65 Bundle OpenVPX (VITA 65 and VITA 65.1) Bundle
ANSI/VITA 65.0-2023 OpenVPX System Standard
ANSI/VITA 65.1-2023 OpenVPX System Standard –Profile Tables
ANSI/VITA 66.0-2016 (R2025) Optical Interconnect on VPX –Base VITA 66.1-2012 Optical Interconnect on VPX –MT Variant
ANSI/VITA 66.2-2013 (S2025) Optical Interconnect On VPX –ARINC 801 Termini Variant
ANSI/VITA 66.3-2012 (R2018) Optical Interconnect on VPX - Mini-Expanded Beam Variant
ANSI/VITA 66.4-2016 (R2025) Optical Interconnect On VPX –Half Width MT Variant
ANSI/VITA 66.5-2022 +Errata Optical Interconnect on VPX - Hybrid Variants
ANSI/VITA 67.0-2019 Coaxial Interconnect on VPX –Base Standard
ANSI/VITA 67.0-2019 Coaxial Interconnect on VPX –Base Standard
ANSI/VITA 67.1-2019 Coaxial Interconnect on VPX, 4 Position SMPM Configuration Coaxial Interconnect on VPX, 4 Position SMPM Configuration
ANSI/VITA 67.2-2020 Coaxial Interconnect on VPX, 8 Position SMPM Configuration
ANSI/VITA 67.3-2023 Coaxial Interconnect on VPX - Spring-Loaded Contact on Backplane
ANSI/VITA 68.0-2025 VPX Compliance Channel Standard
ANSI/VITA 68.1-2025 VPX Compliance Channel - Fixed Signal Integrity Budget Standard
ANSI/VITA 68.2-2021 VPX Standard S-Parameter Definition
VITA 68.3-2024-VDSTU Reference SI Model Standard for Gen4 and Higher Speeds
ANSI/VITA 74.0-2022 Compliant System Small Form Factor Module (VNX) Base Standard
ANSI/VITA 76-2016 (R2021) "High Performance Cable -Ruggedized 10 Gbaud Bulkhead Connector for Cu and AOC Cables"
ANSI/VITA 78.0-2022 SpaceVPX System Standard
ANSI/VITA 86-2025 High Voltage Input Sealed Connector Power Supply
ANSI/VITA 87.0-2024 High Density (HD) MT Circular Connector - Type 1
ANSI/VITA 88.0-2021 Switched Mezzanine Card Plus (XMC+) Standard
ANSI/VITA 91.0-2024 Connector for Higher Density VPX Applications

Download Contact: 1395833280@foxmail.com
ipcstd@outlook.com

IPC-A-600M_Acceptability of Printed Boards 2025

IPCSTD@OUTLOOK.COM