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Previews available in: English
Showing 3 featured editions. View all 3 editions?
Edition | Availability |
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1
Advanced Materials for Thermal Management of Electronic Packaging
Feb 25, 2013, Springer
paperback
1461427924 9781461427926
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2
Advanced Materials for Thermal Management of Electronic Packaging
Jul 21, 2011, Springer
paperback
1441977600 9781441977601
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3
Advanced materials for thermal management of electronic packaging
2011, Springer
in English
1441977589 9781441977588
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Book Details
Table of Contents
Thermal management fundamentals and design guides in electronic packaging
Characterization methodologies of thermal management materials
Electronic packaging materials and their functions in thermal managements
Monolithic carbonaceous materials and carbon matrix composites
Thermally conductive polymer matrix composites
HIgh thermal conductivity metal matrix composites
Thermally conductive ceramic matrix composites
Thermal interface materials in electronic packaging
Materials and design for advanced heat spreader and air cooling heat sinks
Liquid cooling devices and their materials selection
Thermoelectric cooling through thermoelectric materials
Development and application of advanced thermal management materials
Standards and specifications for evaluation of thermal management in electronic industry.
Edition Notes
Includes bibliographical references and index.
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- Created October 23, 2011
- 7 revisions
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February 26, 2022 | Edited by ImportBot | import existing book |
February 26, 2022 | Edited by ImportBot | import existing book |
October 17, 2020 | Edited by MARC Bot | import existing book |
May 17, 2020 | Edited by CoverBot | Added new cover |
October 23, 2011 | Created by LC Bot | Imported from Library of Congress MARC record |