Materials for Information Technology

Devices, Interconnects and Packaging (Engineering Materials and Processes)

1 edition
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Last edited by ImportBot
March 28, 2025 | History

Materials for Information Technology

Devices, Interconnects and Packaging (Engineering Materials and Processes)

1 edition

This edition doesn't have a description yet. Can you add one?

Publish Date
Publisher
Springer
Language
English
Pages
508

Buy this book

Book Details


Classifications

Library of Congress
TA1-2040TK7800-8360T, TK7874 .E75 2003

The Physical Object

Format
Hardcover
Number of pages
508
Dimensions
9.3 x 6.3 x 1.3 inches
Weight
1.8 pounds

Edition Identifiers

Open Library
OL8974499M
ISBN 10
1852339411
ISBN 13
9781852339418
LCCN
2005924304
OCLC/WorldCat
57638535
LibraryThing
6381449
Goodreads
6026031

Work Identifiers

Work ID
OL18353168W

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
March 28, 2025 Edited by ImportBot Redacting ocaids
January 28, 2023 Edited by ImportBot import existing book
November 14, 2022 Edited by ImportBot import existing book
December 14, 2020 Edited by MARC Bot import existing book
April 30, 2008 Created by an anonymous user Imported from amazon.com record