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Subjects
Materials, Congresses, Microelectronics, Information technologyEdition | Availability |
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1
Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)
October 6, 2005, Springer
Hardcover
in English
- 1 edition
1852339411 9781852339418
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- Created April 30, 2008
- 16 revisions
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March 28, 2025 | Edited by ImportBot | Redacting ocaids |
January 28, 2023 | Edited by ImportBot | import existing book |
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December 14, 2020 | Edited by MARC Bot | import existing book |
April 30, 2008 | Created by an anonymous user | Imported from amazon.com record |